Abstract: A semiconductor device includes a light-emitting element, a light-receiving element, an input-side terminal, a first switching element, a first lead and a resin package. The first lead includes a first mount bed and a first output-side terminal, the first switching element being mounted on the first mount bed. The resin package seals the light-emitting element, the light-receiving element, and the first switching element. The resin package includes first and second side surfaces opposite to each other. The input-side terminal protrudes from the first side surface. The first output-side terminal protrudes from the second side surface. The first switching element is sealed at a center between the first and second side surfaces. The first mount bed is arranged in a direction along the second side surface so that a side surface of the first mount bed is positioned between a center of the resin package and the first output-side terminal.

Abstract: An information processing apparatus includes a controller, a first storage unit, a second storage unit, and a classification unit. The controller stores pieces of information retained in a memory on a nonvolatile storage device and, upon startup, makes the information processing apparatus return to a state before power-down. The first storage unit is part of the nonvolatile storage device and stores some pieces of information among the pieces of information retained in the memory. The second storage unit is part of the nonvolatile storage device and stores pieces of information different from those stored on the first storage unit among the pieces of information retained in the memory. The classification unit classifies the pieces of information retained in the memory. The controller stores the pieces of information retained in the memory on the first storage unit or the second storage unit in accordance with classification performed by the classification unit.

Abstract: An information processing apparatus includes first and second central processing units, a communication unit, and a memory. The first and second central processing units operate based on first and second operating systems, respectively. The communication unit controls communication between the first and second operating systems. The memory includes first and second memory areas used respectively by the first and second operating systems. The first operating system includes a memory access requesting unit. The memory access requesting unit sends, to the second operating system via the communication unit, a request to write information to be moved from the first memory area to a virtual memory and a request to read information to be moved from the virtual memory to the first memory area. The second operating system writes to and reads from the second memory area, the information indicated by the write and read requests, respectively.

Abstract: A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: An information processing apparatus includes a controller, a first storage unit, a second storage unit, and a classification unit. The controller stores pieces of information retained in a memory on a nonvolatile storage device and, upon startup, makes the information processing apparatus return to a state before power-down. The first storage unit is part of the nonvolatile storage device and stores some pieces of information among the pieces of information retained in the memory. The second storage unit is part of the nonvolatile storage device and stores pieces of information different from those stored on the first storage unit among the pieces of information retained in the memory. The classification unit classifies the pieces of information retained in the memory. The controller stores the pieces of information retained in the memory on the first storage unit or the second storage unit in accordance with classification performed by the classification unit.

Abstract: An information processing apparatus includes first and second central processing units, a communication unit, and a memory. The first and second central processing units operate based on first and second operating systems, respectively. The communication unit controls communication between the first and second operating systems. The memory includes first and second memory areas used respectively by the first and second operating systems. The first operating system includes a memory access requesting unit. The memory access requesting unit sends, to the second operating system via the communication unit, a request to write information to be moved from the first memory area to a virtual memory and a request to read information to be moved from the virtual memory to the first memory area. The second operating system writes to and reads from the second memory area, the information indicated by the write and read requests, respectively.

Abstract: A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: A solenoid control device executes feedback control such that a drive current for a solenoid follows a target current, by driving, through PWM, a MOSFET provided on a power supply line to the solenoid. An overcurrent detection circuit that outputs an overcurrent detection signal when the drive current for the solenoid reaches an overcurrent determination current value is provided, and it is determined whether an overcurrent is generated. Whether a short-circuit occurs between both terminals of the solenoid is determined by monitoring whether the overcurrent detection circuit is repeating an output of the overcurrent detection signal and a stop of the output of the overcurrent detection signal.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: A method for manufacturing a photocoupler includes: mounting light emitting devices and light receiving devices on a lead frame sheet; positioning the lead frame sheet with respect to a die by cutting off the one set of column portions from a linking portion and inserting a first pilot pin formed on the die into a second pilot hole; opposing the light emitting devices and the light receiving devices to each other; connecting the light emitting side coupling bars and the light receiving side coupling bars to each other on the die; forming a resin body so as to cover a pair of the light emitting device and the light receiving device; and cutting off the light emitting side lead frame portion from the light emitting column portion and cutting off the light receiving side lead frame portion from the light receiving column portion.

Abstract: According to an embodiment, a semiconductor device including a first body molded with a first resin, a second body molded with the first resin, and a third body molded with a second resin. The first body includes a first light emitting element, a primary lead, a first light receiving element, and a secondary lead. The second body includes a second light emitting element, a primary lead, a second light receiving element, and a secondary lead. The third body includes the first body and the second body. At least one common lead includes the primary leads or the secondary leads, and a portion extending between the first body and the second body, the portion being covered with a first thin film linked to the first body and a second thin film linked to the second body.

Abstract: According to an embodiment, a semiconductor device including a first body molded with a first resin, a second body molded with the first resin, and a third body molded with a second resin. The first body includes a first light emitting element, a primary lead, a first light receiving element, and a secondary lead. The second body includes a second light emitting element, a primary lead, a second light receiving element, and a secondary lead. The third body includes the first body and the second body. At least one common lead includes the primary leads or the secondary leads, and a portion extending between the first body and the second body, the portion being covered with a first thin film linked to the first body and a second thin film linked to the second body.

Abstract: According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The light emitting element is fixed on the first lead. The second lead is provided away from the first lead and electrically connected to the light emitting element via a metal wire. The, molded body made of a sealing resin covers the light emitting element, end portions of the first lead and the second lead, the light emitting element being fixed on the end portion of the first read, and the metal wire being bonded on the end portion of the second lead. The first groove is provided between first and second portions in a front surface of the second lead, the first portion being in contact with an outer edge of the molded body and the metal wire being bonded on the second portion.