Patents by Inventor Atsushi Taya

Atsushi Taya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085828
    Abstract: An intermediate transfer member including a base layer, wherein the base layer contains a thermoplastic resin and an electroconductive filler dispersed in the thermoplastic resin, and wherein the base layer has a volume resistivity of 1×106 to 1×1013 ?·cm, and the base layer has an electroconductive path index of 0.20 or less.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 14, 2024
    Inventors: ATSUSHI HORI, AKIHIRO TAYA, MEGUMI UCHINO, KOJI SATO
  • Patent number: 8703517
    Abstract: In a manufacturing method of a semiconductor device, a substrate including single crystalline silicon is prepared, a reformed layer that continuously extends is formed in the substrate, and the reformed layer is removed by etching. The forming the reformed layer includes polycrystallizing a portion of the single crystalline silicon by irradiating the substrate with a pulsed laser beam while moving a focal point of the laser beam in the substrate.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: April 22, 2014
    Assignee: DENSO CORPORATION
    Inventors: Atsushi Taya, Katsuhiko Kanamori, Masashi Totokawa
  • Patent number: 8655630
    Abstract: A design workflow construction apparatus is provided for supporting design of an object having a plurality of design elements. In constructing the design workflow, the apparatus uses input variables, design variables, and intermediate variables. The design workflow construction apparatus includes means for acquiring object design elements and means for determining an order of designing the object design elements. The apparatus also includes means for determining the important design variables.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: February 18, 2014
    Assignee: Osaka University
    Inventors: Yoshiharu Iwata, Ryohei Satoh, Keiji Kudo, Atsushi Taya, Kazuya Okamoto, Hidenori Murata, Koichiro Atsumi, Eiji Arai, Eiji Morinaga
  • Publication number: 20120107994
    Abstract: In a manufacturing method of a semiconductor device, a substrate including single crystalline silicon is prepared, a reformed layer that continuously extends is formed in the substrate, and the reformed layer is removed by etching. The forming the reformed layer includes polycrystallizing a portion of the single crystalline silicon by irradiating the substrate with a pulsed laser beam while moving a focal point of the laser beam in the substrate.
    Type: Application
    Filed: October 24, 2011
    Publication date: May 3, 2012
    Applicant: DENSO CORPORATION
    Inventors: Atsushi TAYA, Katsuhiko Kanamori, Masashi Totokawa
  • Publication number: 20120053905
    Abstract: A design system (1) is provided with a function of acquiring a design specification of an object to be designed and an evaluation index for evaluating a value of the object to be designed in the design specification; a function of acquiring profile data of the object to be designed; a function (design order determining section (12)) of extracting entity design elements and important design variables from the profile data and prioritizing the entity design elements and the important design variables so as to construct a design workflow; a function (evaluation approach construction section (13)) of constructing an evaluation formula for performance/evaluation of a design result of each of the entity design elements in conformity with the design workflow; a function of finding an appropriate solution by performing automatic optimization while evaluating the design result with use of the evaluation index in accordance with the design workflow with which the evaluation formula is associated; and a function of outp
    Type: Application
    Filed: February 16, 2010
    Publication date: March 1, 2012
    Applicant: Osaka University
    Inventors: Yoshiharu Iwata, Ryohei Satoh, Keiji Kudo, Atsushi Taya, Kazuya Okamoto, Hidenori Murata, Koichiro Atsumi, Eiji Arai, Eiji Morinaga
  • Patent number: 8077771
    Abstract: A moving-image-data acquiring unit acquires, when a failure occurs in other moving-image distributing apparatus, a plurality of moving-image data transmitted from a part of the encoders to the other moving-image distributing apparatus. An imaging-target-information acquiring unit acquires location information of an imaging target from a management server that manages the location information of the imaging target. An encoder selecting unit selects the encoder to take charge in place of the other moving-image distributing apparatus, based on encoder location information included in the moving-image data and the location information of the imaging target.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: December 13, 2011
    Assignee: Fujitsu Limited
    Inventors: Tomonori Hirose, Atsushi Taya
  • Publication number: 20060193381
    Abstract: A moving-image-data acquiring unit acquires, when a failure occurs in other moving-image distributing apparatus, a plurality of moving-image data transmitted from a part of the encoders to the other moving-image distributing apparatus. An imaging-target-information acquiring unit acquires location information of an imaging target from a management server that manages the location information of the imaging target. An encoder selecting unit selects the encoder to take charge in place of the other moving-image distributing apparatus, based on encoder location information included in the moving-image data and the location information of the imaging target.
    Type: Application
    Filed: April 26, 2006
    Publication date: August 31, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Tomonori Hirose, Atsushi Taya