Patents by Inventor Atsushi Teranishi

Atsushi Teranishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240042756
    Abstract: An object is to provide a liquid ejection head that is more reliable than conventional ones. The liquid ejection head includes a pitch conversion member. The pitch conversion member includes a plurality of first openings respectively connected to a plurality of first channels, and a plurality of second openings respectively connected to a plurality of second channels. A region where a plurality of the first openings are provided and a region where a plurality of the second openings are provided overlap as viewed from a penetration direction of the first openings and the second openings. A first distance in a second array direction between the two first openings closest to each other in the second array direction intersecting a first array direction is shorter than a second distance in the second array direction between the two second openings closest to each other in the second array direction.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 8, 2024
    Inventors: ATSUSHI TERANISHI, NAOKO SHIMIZU
  • Publication number: 20240034061
    Abstract: A liquid ejection head includes ejection orifices for ejecting liquid, common liquid chambers connected to the ejection orifices, common flow passages, and pitch conversion flow passages that connects the common flow passages and liquid chambers to each other. The pitch conversion flow passages includes a periphery formed with resin. In a case where a number of pitch conversion flow passages in a group is minimum on a condition that one or more of the pitch conversion flow passages are respectively included in the group, the pitch conversion flow passages have a repeating pattern in which the group is repeatedly arranged. At least one of two pitch conversion flow passages adjoining an m-th pitch conversion flow passage (m is all integers from 1 to n?2, where n is an integer of 3 or more) is one of first to (m+1)-th pitch conversion flow passages.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Inventors: Naoko Shimizu, Toru Nakakubo, Kazuhiro Yamada, Atsushi Teranishi, Osamu Kanome
  • Patent number: 11850855
    Abstract: A liquid ejection head includes ejection orifices for ejecting liquid, common liquid chambers connected to the ejection orifices, common flow passages, and pitch conversion flow passages that connects the common flow passages and liquid chambers to each other. The pitch conversion flow passages includes a periphery formed with resin. In a case where a number of pitch conversion flow passages in a group is minimum on a condition that one or more of the pitch conversion flow passages are respectively included in the group, the pitch conversion flow passages have a repeating pattern in which the group is repeatedly arranged. At least one of two pitch conversion flow passages adjoining an m-th pitch conversion flow passage (m is all integers from 1 to n?2, where n is an integer of 3 or more) is one of first to (m+1)-th pitch conversion flow passages.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: December 26, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Naoko Shimizu, Toru Nakakubo, Kazuhiro Yamada, Atsushi Teranishi, Osamu Kanome
  • Patent number: 11813864
    Abstract: A liquid ejection head includes ejection orifices for ejecting liquid, common liquid chambers connected to the ejection orifices, common flow passages, and pitch conversion flow passages that connects the common flow passages and liquid chambers to each other. The pitch conversion flow passages includes a periphery formed with resin. In a case where a number of pitch conversion flow passages in a group is minimum on a condition that one or more of the pitch conversion flow passages are respectively included in the group, the pitch conversion flow passages have a repeating pattern in which the group is repeatedly arranged. At least one of two pitch conversion flow passages adjoining an m-th pitch conversion flow passage (m is all integers from 1 to n?2, where n is an integer of 3 or more) is one of first to (m+1)-th pitch conversion flow passages.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: November 14, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Naoko Shimizu, Toru Nakakubo, Kazuhiro Yamada, Atsushi Teranishi, Osamu Kanome
  • Publication number: 20230311500
    Abstract: A liquid ejection head includes: an array of ejection ports; pressure chambers corresponding respectively to and communicating with the ejection ports; individual supply channels and individual collection channels communicating with the chambers; a common supply channel communicating with surfaces of the individual supply channels opposite to surfaces thereof communicating with the chambers; a common collection channel communicating with surfaces of the individual collection channels opposite to surfaces thereof communicating with the chambers; and a damper member forming a wall of a part of a channel in the common collection channel. A wall of a part of a channel in the common supply channel is not formed by the damper member. The common supply channel and the common collection channel are formed so as to extend in a first direction along the ejection port array, and are disposed side by side in a second direction crossing the ejection port array.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 5, 2023
    Inventors: AKIKO HAMMURA, YOSHIYUKI NAKAGAWA, TAKURO YAMAZAKI, ATSUSHI TERANISHI
  • Publication number: 20230311501
    Abstract: An object is to provide a liquid ejection head and liquid ejection apparatus capable of reducing or preventing a decrease in image quality without increasing the chip size. To achieve this, a configuration is employed in which a bonding layer is not provided between a liquid supply substrate and channel partitions between common supply channels and common collection channels, and a minute communication portion is provided there.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 5, 2023
    Inventors: Yoshiyuki Nakagawa, TAKURO YAMAZAKI, AKIKO HAMMURA, ATSUSHI TERANISHI
  • Publication number: 20230311499
    Abstract: A liquid ejection head includes: an ejection port array being an array of ejection ports; a plurality of pressure chambers corresponding respectively to the ejection ports and communicating with the ejection ports; individual supply channels and individual collection channels communicating with the pressure chambers; a common supply channel communicating with surfaces of the individual supply channels opposite to surfaces thereof communicating with the pressure chambers; a common collection channel communicating with surfaces of the individual collection channels opposite to surfaces thereof communicating with the pressure chambers; and a damper member forming a wall of a part of at least one of the common supply channel or the common collection channel. The common supply channel and the common collection channel are formed so as to extend in a first direction along the ejection port array, and are disposed side by side in a second direction crossing the ejection port array.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 5, 2023
    Inventors: AKIKO HAMMURA, YOSHIYUKI NAKAGAWA, TAKURO YAMAZAKI, ATSUSHI TERANISHI
  • Publication number: 20230302796
    Abstract: A liquid ejection head includes a plurality of nozzles arranged along a first direction of an ejection surface, a plurality of pressure chambers communicating with the plurality of individual nozzles and provided with actuators configured to apply, to a liquid, pressures for ejecting the liquid from the nozzles, a plurality of discrete flow paths communicating with the plurality of individual pressure chambers, a common flow path communicating with the plurality of individual discrete flow paths via discrete opening portions and extending in the first direction, and a damper mechanism disposed to face the common flow path in a direction crossing the ejection surface to absorb a pressure fluctuation in the liquid in the common flow path. The common flow path is provided with a partition wall disposed between the discrete opening portions adjacent in the first direction to extend in the direction crossing the ejection surface.
    Type: Application
    Filed: March 23, 2023
    Publication date: September 28, 2023
    Inventors: Takuro YAMAZAKI, Yoshiyuki NAKAGAWA, Akiko HAMMURA, Atsushi TERANISHI
  • Publication number: 20220176700
    Abstract: A liquid ejection head includes ejection orifices for ejecting liquid, common liquid chambers connected to the ejection orifices, common flow passages, and pitch conversion flow passages that connects the common flow passages and liquid chambers to each other. The pitch conversion flow passages includes a periphery formed with resin. In a case where a number of pitch conversion flow passages in a group is minimum on a condition that one or more of the pitch conversion flow passages are respectively included in the group, the pitch conversion flow passages have a repeating pattern in which the group is repeatedly arranged. At least one of two pitch conversion flow passages adjoining an m-th pitch conversion flow passage (m is all integers from 1 to n?2, where n is an integer of 3 or more) is one of first to (m+1)-th pitch conversion flow passages.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 9, 2022
    Inventors: Naoko Shimizu, Toru Nakakubo, Kazuhiro Yamada, Atsushi Teranishi, Osamu Kanome
  • Patent number: 11168397
    Abstract: A method for producing a substrate that includes a protective layer made from a metal oxide protecting silicon against corrosion and an organic resin layer on a substrate surface of a silicon substrate includes the following steps in this order: step A of forming the protective layer on the substrate surface; step B of removing the protective layer from the substrate surface in a region Z1 that is a part of the region in which the protective layer has been formed; and step C of providing an organic resin layer on the substrate surface in a region Z2 including the region Z1.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 9, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Atsushi Teranishi
  • Patent number: 11081349
    Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: August 3, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masaya Uyama, Souta Takeuchi, Taichi Yonemoto, Kazuaki Shibata, Atsushi Teranishi, Takeru Yasuda, Atsunori Terasaki
  • Patent number: 11001062
    Abstract: A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: May 11, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Atsushi Teranishi, Masaya Uyama, Takeru Yasuda
  • Publication number: 20200227252
    Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.
    Type: Application
    Filed: February 6, 2019
    Publication date: July 16, 2020
    Inventors: Masaya Uyama, Souta Takeuchi, Taichi Yonemoto, Kazuaki Shibata, Atsushi Teranishi, Takeru Yasuda, Atsunori Terasaki
  • Publication number: 20200189275
    Abstract: A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.
    Type: Application
    Filed: December 10, 2019
    Publication date: June 18, 2020
    Inventors: Atsushi Teranishi, Masaya Uyama, Takeru Yasuda
  • Patent number: 10343403
    Abstract: A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: July 9, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Atsushi Teranishi, Masaya Uyama
  • Patent number: 10315426
    Abstract: A method for forming a patterned film on a substrate includes: step of patterning a mask material on the substrate, thereby covering, with the mask material, the region except a patterned film forming region on a substrate surface on which the patterned film is to be formed; step of covering, with a protective member, at least a part of the surface of the mask material opposite to the substrate so as to allow the patterned film forming region to communicate with outside air, thereby forming a workpiece to be subjected to film formation in following step; step of forming a film on at least the patterned film forming region of the surface of the workpiece communicating with the outside air; step of releasing the protective member from the mask material; and step of removing the mask material and a part of the film on the mask material.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 11, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Atsushi Teranishi, Yoshiyuki Fukumoto
  • Patent number: 10155385
    Abstract: A liquid ejection head includes: a substrate including an energy-generating element; a flow path forming member including a discharge port and having a liquid flow path formed between the flow path forming member and the substrate; and a plurality of through-passages passing through the substrate, each of the through-passages including a first through-passage part serving as a common liquid chamber and a plurality of second through-passage parts communicating with the first through-passage part, wherein a separation wall separating the adjacent first through-passage parts includes a plate-shaped member separating the adjacent first through-passage parts and approximately vertical to a substrate in-plane direction and, at least one protrusion protruding from the plate-shaped member in the substrate in-plane direction and contacting a bottom portion of the first through-passage part.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: December 18, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Atsushi Hiramoto, Ryoji Kanri, Yoshiyuki Fukumoto, Atsunori Terasaki, Atsushi Teranishi, Masahiko Kubota
  • Publication number: 20180179632
    Abstract: A method for producing a substrate that includes a protective layer made from a metal oxide protecting silicon against corrosion and an organic resin layer on a substrate surface of a silicon substrate includes the following steps in this order: step A of forming the protective layer on the substrate surface; step B of removing the protective layer from the substrate surface in a region Z1 that is a part of the region in which the protective layer has been formed; and step C of providing an organic resin layer on the substrate surface in a region Z2 including the region Z1.
    Type: Application
    Filed: November 8, 2017
    Publication date: June 28, 2018
    Inventor: Atsushi Teranishi
  • Publication number: 20180170054
    Abstract: A method for forming a patterned film on a substrate includes: step of patterning a mask material on the substrate, thereby covering, with the mask material, the region except a patterned film forming region on a substrate surface on which the patterned film is to be formed; step of covering, with a protective member, at least a part of the surface of the mask material opposite to the substrate so as to allow the patterned film forming region to communicate with outside air, thereby forming a workpiece to be subjected to film formation in following step; step of forming a film on at least the patterned film forming region of the surface of the workpiece communicating with the outside air; step of releasing the protective member from the mask material; and step of removing the mask material and a part of the film on the mask material.
    Type: Application
    Filed: November 2, 2017
    Publication date: June 21, 2018
    Inventors: Atsushi Teranishi, Yoshiyuki Fukumoto
  • Publication number: 20180170047
    Abstract: A liquid ejection head includes: a substrate including an energy-generating element; a flow path forming member including a discharge port and having a liquid flow path formed between the flow path forming member and the substrate; and a plurality of through-passages passing through the substrate, each of the through-passages including a first through-passage part serving as a common liquid chamber and a plurality of second through-passage parts communicating with the first through-passage part, wherein a separation wall separating the adjacent first through-passage parts includes a plate-shaped member separating the adjacent first through-passage parts and approximately vertical to a substrate in-plane direction and, at least one protrusion protruding from the plate-shaped member in the substrate in-plane direction and contacting a bottom portion of the first through-passage part.
    Type: Application
    Filed: December 1, 2017
    Publication date: June 21, 2018
    Inventors: Atsushi Hiramoto, Ryoji Kanri, Yoshiyuki Fukumoto, Atsunori Terasaki, Atsushi Teranishi, Masahiko Kubota