Abstract: A multilayer LC composite component minimizes the inductances of ground patterns to prevent electromagnetic waves from leaking outside the component. The multilayer LC composite component includes ground patterns having large areas arranged in the upper and lower sections of the component, with inductor patterns and resonant capacitor patterns arranged between the ground patterns. The ground patterns have portions extended in different positions such that no clearance is left between the extended portions in plan view.

Abstract: A multi-layered LC filter includes a plurality of insulating sheets stacked on each other and inductor via holes that are connected to each other in a stacking direction of insulating sheets, forming two columnar inductors. First ends of the inductors are connected to external ground electrodes via internal ground patterns, respectively. The external ground electrodes are electrically connected via a bridge pattern disposed in proximity to the inductors, allowing adjustment of the value of the magnetic coupling between LC resonators without changing the size of the filter.

Abstract: A multilayer LC composite component minimizes the inductances of ground patterns to prevent electromagnetic waves from leaking outside the component. The multilayer LC composite component includes ground patterns having large areas arranged in the upper and lower sections of the component, with inductor patterns and resonant capacitor patterns arranged between the ground patterns. The ground patterns have portions extended in different positions such that no clearance is left between the extended portions in plan view.

Abstract: A multi-layered LC filter includes a plurality of insulating sheets stacked on each other and inductor via holes that are connected to each other in a stacking direction of insulating sheets, forming two columnar inductors. First ends of the inductors are connected to external ground electrodes via internal ground patterns, respectively. The external ground electrodes are electrically connected via a bridge pattern disposed in proximity to the inductors, allowing adjustment of the value of the magnetic coupling between LC resonators without changing the size of the filter.

Abstract: A small inductor built-in electronic part whose Q is high is provided. An LC resonator comprises a laminate composed of a number of laminated electronic layers. Capacitor electrodes, common electrodes, and ground electrodes are formed between the dielectric layers. Two via holes are formed penetrating through the plurality of intermediate dielectric layers in the thickness direction thereof leaving a space therebetween. These via holes act as inductor elements.

Abstract: An LC resonating component, such as multilayered LC filter 1, is provided having a high Q-value and a low profile. The filter 1 comprises an insulating sheet 2 having a ground electrode 3 on its surface and in its center a via hole 7 connected to the ground electrode 3, an insulating sheet 2 having a via hole 4 in its center, insulating sheets 2, 2 having capacitor electrodes 5, 6 on their respective surfaces, and a protective insulating sheet 2. The via hole 7 is connected to the via hole 4, wherein the via holes 4 and 7 together comprise an inductor conductive body 8. The inductor conductive body 8 is perpendicular to the planes defined by capacitor electrodes 5, 6, and thus the magnetic flux created around the inductor conductive body 8 does not penetrate the capacitor electrodes 5, 6.

Abstract: An LC resonant device effectively limits radiated noise and provides a high Q-value. In one embodiment, the LC resonant device comprises a laminated LC filter formed of: two insulating sheets having a first ground electrode and a second ground electrode formed on their respective surfaces; an insulating sheet having a third ground electrode on its surface and having a through hole formed in its central portion and connected to the third ground electrode; at least one insulating sheet having a through hole formed in its central portion; two insulating sheets having first and second capacitor electrodes on their surfaces respectively; and a cover insulating sheet. The through holes form an inductive conductor perpendicular to the capacitor electrodes. At least, one of the three ground electrodes is connected directly to the inductive conductor and the other ground electrodes are not directly connected to the inductive conductor.

Abstract: There is provided an LC filter in which the leakage of an electromagnetic field to the outside is suppressed. The LC filter 20 includes a laminated element 22. The laminated element 22 includes a multiplicity of dielectric layers 24a-24h. One end of a pattern electrode 34a serving as an inductor of an LC resonator is connected to a capacitor electrode 30a serving as a part of a capacitor of an LC resonator through a via hole formed in the dielectric layers 24d and 24e. The other end of the pattern electrode 34a is connected to one end of a pattern electrode 36a through a via hole formed in the dielectric layer 24f. The other end of the pattern electrode 36a is connected to a ground electrode 32a through a via hole formed in the dielectric layers 24e and 24f. Similarly, one end of a pattern electrode 34b serving as an inductor of another LC resonator is connected to a capacitor electrode 30b serving as a part of a capacitor of an LC resonator through a via hole formed in the dielectric layers 24d and 24e.

Abstract: A chip-type electronic component comprising at least one electronic component element which is mounted on a substrate. The electronic component element is provided on its upper portion with a flat surface which can be engaged by a suction nozzle.

Abstract: A multi-layer substrate which should be used with an inductor. The multi-layer substrate has an internal coil which should be connected with the inductor electrically. The internal coil has such an inductance value that the total inductance of the inductor and the internal coil will be a specified value.

Abstract: A method of forming bump electrodes, which is characterized in that conductive pastes are applied to a surface on which bump electrodes are to be formed, metal balls are made to adhere to the applied conductive pastes utilizing the viscosity of the conductive pastes before the conductive pastes are dried, and the conductive pastes and the metal balls are cofired.