Abstract: A humidity sensing portion is mounted in a gap between a first opposite member and a second opposite member. Metal joints and dummy joints are provided in the gap between the first opposite member and the second opposite member, and the two opposite members are fixed to each other through the metal joints and the dummy joints. Since only the metal joints and the dummy joints are present in the gap between the two opposite members, gas to be measured is easily introduced into the humidity sensing portion, and the sensing response to the humidity change is improved.

Abstract: A humidity detection sensor includes a lower electrode provided on a board, an upper electrode provided so as to face the lower electrode, a humidity sensing film which is formed at least between the lower electrode and the upper electrode and whose dielectric constant changes in response to humidity, and a protective film provided so as to cover the upper electrode. Each of the upper electrode and the protective film has an opening through which the humidity sensing film is partially exposed to the outside. In the opening, the humidity sensing film is provided so as to reach at least a position higher than the position of the lower surface of the protective film.

Abstract: A humidity sensing portion is mounted in a gap between a first opposite member and a second opposite member. Metal joints and dummy joints are provided in the gap between the first opposite member and the second opposite member, and the two opposite members are fixed to each other through the metal joints and the dummy joints. Since only the metal joints and the dummy joints are present in the gap between the two opposite members, gas to be measured is easily introduced into the humidity sensing portion, and the sensing response to the humidity change is improved.

Abstract: A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.

Abstract: A method of processing an air bearing surface of a thin-film magnetic head slider is provided. A first silicon film, a first carbon film, a second silicon film, and a second carbon film are laminated in that order on a face of a thin-film magnetic head slider facing a medium. A protrusion resist pattern that forms protrusions is formed on the second carbon film. Portions of the second carbon film and the second silicon film that are not covered with the protrusion resist pattern are removed by reactive ion etching with O2/CF4. A third carbon film is formed on the first carbon film exposed by the removal of the portions. The protrusion resist pattern is removed to expose the protrusions including the second silicon film and the second carbon film. An ABS resist pattern is formed on exposed surfaces of the protrusions and the third carbon film. A surface not covered with the ABS resist pattern is processed to impart an ABS uneven pattern.

Abstract: A thin film magnetic head includes: an element part formed by laminating an antiferromagnetic layer, a fixed magnetic layer, an insulating barrier layer, and a free magnetic layer on a substrate; and a protective layer that protects an end surface of the element part opposite a recording medium. The insulating barrier layer is formed using an AlOx film or an MgO film.

Abstract: A thin-film magnetic head is provided. The thin-ffilm magnetic head includes an element portion including an antiferromagnetic layer, a pinned magnetic layer, an insulating barrier layer, and a free magnetic layer laminated on a substrate. A protective layer that protects an end face of the element portion where the end face faces a recording medium. An adhesion layer is disposed between the protective layer and the end face of the element portion, the insulating barrier layer is exposed at the end face of the element portion. The insulating barrier layer is a TiOx film, and nitrogen is present in at least the interface between the adhesion layer and the insulating barrier layer.

Abstract: A method of processing an air bearing surface of a thin-film magnetic head slider is provided. A first silicon film, a first carbon film, a second silicon film, and a second carbon film are laminated in that order on a face of a thin-film magnetic head slider facing a medium. A protrusion resist pattern that forms protrusions is formed on the second carbon film. Portions of the second carbon film and the second silicon film that are not covered with the protrusion resist pattern are removed by reactive ion etching with O2/CF4. A third carbon film is formed on the first carbon film exposed by the removal of the portions. The protrusion resist pattern is removed to expose the protrusions including the second silicon film and the second carbon film. An ABS resist pattern is formed on exposed surfaces of the protrusions and the third carbon film. A surface not covered with the ABS resist pattern is processed to impart an ABS uneven pattern.