Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: The present invention provides a protein having pentosidine oxidase activity, a method for measuring pentosidine comprising: contacting the protein with a specimen; and detecting a change caused by the contact, and the like.

Abstract: To prevent unnecessary light ray reflection in a semiconductor module employing a chip-on-chip structure or a chip-on-wafer structure. The semiconductor module includes a substrate, first and second semiconductor elements, and a cover part. The first semiconductor element is arranged on the substrate. The first semiconductor element includes a wiring electrically connected to the substrate and a pixel region of an imaging element on an upper surface opposite to a surface facing the substrate. The second semiconductor element is arranged at a position different from the pixel region on the upper surface of the first semiconductor element. The cover part covers the first and second semiconductor elements from the upper surface with respect to at least a part of a region excluding the pixel region.

Abstract: A yield drop of a semiconductor package including a via is reduced. The semiconductor package includes a solid-state imaging element, a circuit layer, a wiring layer, and a support substrate. The solid-state imaging element in the semiconductor package generates image data. A signal processing circuit that performs predetermined signal processing on the image data is disposed in the circuit layer. An output side via the other end of which is connected to an external terminal penetrates the support substrate. The wiring layer is disposed between the support substrate and the circuit layer. A signal line that connects the signal processing circuit and one end of the output side via is wired in the wiring layer.

Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: [Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.

Abstract: [Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.

Abstract: A spark plug, comprised of: an insulator having an axial bore extending in the direction of an axis, a first inner circumferential surface extending at a forward side of the axial bore, a second inner circumferential surface extending at a rear side of the axial bore and having a diameter greater than that of the first inner circumferential surface, and a ledge connecting the first inner circumferential surface and the second inner circumferential surface; a center electrode having a head supported by the ledge and extending in a space surrounded by the second inner circumferential surface, and a circular columnar leg extending continuously from the forward end of the head in a space surrounded by the first inner circumferential surface; and a seal material for holding the center electrode in the axial bore.

Abstract: A spark plug includes an insulator having an axial hole, a first inner circumferential surface, a second inner circumferential surface whose diameter is greater than that of the first inner circumferential surface, and a ledge portion connecting the first and the second inner circumferential surfaces. The spark plug also includes a center electrode having a large-diameter portion, a projection portion, and a circular columnar leg portion that projects into a space surrounded by the first inner circumferential surface. The spark plug includes a seal portion which fixes the center electrode within the axial hole. When C<A, A?C?B?A, where A represents a diameter of an imaginary cylinder having the minimum diameter required for surrounding the projection portion, B represents a maximum diameter of the large-diameter portion, and C represents an average diameter of the leg portion present in the space surrounded by the first inner circumferential surface.

Abstract: A spark plug, comprised of: an insulator having an axial bore extending in the direction of an axis, a first inner circumferential surface extending at a forward side of the axial bore, a second inner circumferential surface extending at a rear side of the axial bore and having a diameter greater than that of the first inner circumferential surface, and a ledge connecting the first inner circumferential surface and the second inner circumferential surface; a center electrode having a head supported by the ledge and extending in a space surrounded by the second inner circumferential surface, and a circular columnar leg extending continuously from the forward end of the head in a space surrounded by the first inner circumferential surface; and a seal material for holding the center electrode in the axial bore.

Abstract: A spark plug includes an insulator having an axial hole, a first inner circumferential surface, a second inner circumferential surface whose diameter is greater than that of the first inner circumferential surface, and a ledge portion connecting the first and the second inner circumferential surfaces. The spark plug also includes a center electrode having a large-diameter portion, a projection portion, and a circular columnar leg portion that projects into a space surrounded by the first inner circumferential surface. The spark plug includes a seal portion which fixes the center electrode within the axial hole. When C<A, A?C?B?A, where A represents a diameter of an imaginary cylinder having the minimum diameter required for surrounding the projection portion, B represents a maximum diameter of the large-diameter portion, and C represents an average diameter of the leg portion present in the space surrounded by the first inner circumferential surface.

Abstract: A decrease in yield and degradation of productivity can be avoided when a spark plug having an insulator with low mechanical strength is manufactured. In a second process, a terminal electrode 15 is inserted to a predetermined position in a state where an insulator 12 is heated to a temperature equal to or greater than the softening temperatures of first to third powder materials 16P, 17P, and 18P such that the first powder material 16P becomes a first conductive sealing material layer 16, the second powder material 17P becomes a resistor 17, and the third powder material 18P becomes a second conductive sealing material layer 18. In addition, a speed at which the terminal electrode 15 is inserted is reduced between the start and the end of the second process.

Abstract: A decrease in yield and degradation of productivity can be avoided when a spark plug having an insulator with low mechanical strength is manufactured. In a second process, a terminal electrode 15 is inserted to a predetermined position in a state where an insulator 12 is heated to a temperature equal to or greater than the softening temperatures of first to third powder materials 16P, 17P, and 18P such that the first powder material 16P becomes a first conductive sealing material layer 16, the second powder material 17P becomes a resistor 17, and the third powder material 18P becomes a second conductive sealing material layer 18. In addition, a speed at which the terminal electrode 15 is inserted is reduced between the start and the end of the second process.

Abstract: A solid-state imaging apparatus is provided. The solid-state imaging apparatus includes a solid-state imaging device, an ?-ray shielding layer formed so as to cover at least an imaging area of the solid-state imaging device and a cover glass provided above the ?-ray shielding layer.

Abstract: A solid-state imaging apparatus is provided. The solid-state imaging apparatus includes a solid-state imaging device, an ?-ray shielding layer formed so as to cover at least an imaging area of the solid-state imaging device and a cover glass provided above the ?-ray shielding layer.

Abstract: Low-cost, high-purity strontium nitrate that is low in Ba, Na, Ca, Cr, and other impurities and that is suitable for use in airbags or the like is provided. High-purity strontium nitrate having a Ba content of 0.01 wt % or lower, an Na content of 0.005 wt % or lower, a Ca content of 0.01 wt % or lower, a Cr content of less than 0.001 wt %, and a purity of 99.5 wt % or higher is produced by a manufacturing method comprising a first step for performing crystallization by adding nitric acid to an aqueous solution obtained by dissolving a strontium compound as a starting material, a second step for separating the resulting crystals, a third step for crystallizing the resulting separated solution, and a fourth step for separating the resulting crystals.