Patents by Inventor Atsushi UMEKAWA
Atsushi UMEKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11694907Abstract: A substrate processing apparatus, includes a reaction furnace, a preparatory chamber provided below the reaction furnace, an elevating mechanism configured to raise/lower a substrate holder between the reaction furnace and the preparatory chamber, a fluid circulation mechanism including a suction part for sucking a fluid within the preparatory chamber, a pipe part constituting a flow path through which the fluid flows from the suction part to a supply part, and a cooling mechanism, provided in the flow path, for cooling the fluid, and a control part for controlling the fluid circulation mechanism and the elevating mechanism to circulate the fluid sucked from the suction part through the flow path, and supply the fluid from the supply part to the preparatory chamber. The cooling mechanism is disposed adjacent to the suction part to cool the fluid introduced from the suction part before circulating the fluid through the flow path.Type: GrantFiled: August 2, 2017Date of Patent: July 4, 2023Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Toshiki Fujino, Atsushi Umekawa, Takayuki Nakada
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Publication number: 20220275515Abstract: There is provided a gas supply system including a supplying part connected to a reaction vessel and a blocking part provided at an upstream side of the supplying part and directly connected to the supplying part without providing a pipe between the blocking part and the supplying part. The gas supply system further including a switching part provided at an upstream side of the blocking part and configured to supply a gas into the reaction vessel in cooperation with the blocking part and an exhaust part configured to exhaust an inside of a pipe provided between the switching part and the blocking part.Type: ApplicationFiled: May 16, 2022Publication date: September 1, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Mikio OHNO, Atsushi UMEKAWA, Takeo HANASHIMA, Hiroaki HIRAMATSU
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Patent number: 11365482Abstract: There is provided a substrate processing apparatus including a process chamber defined at least by a reaction tube and a furnace opening part provided at a lower portion of the reaction tube; a nozzle provided at the furnace opening part and extending from the furnace opening part to an inside of the reaction tube; a gas supply system provided at an upstream side of the nozzle; a blocking part provided at a boundary between the gas supply system and the nozzle; and a controller configured to control the gas supply system and the blocking part such that the blocking part co-operates with the gas supply system to supply gases into the process chamber through the nozzle.Type: GrantFiled: March 27, 2020Date of Patent: June 21, 2022Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Mikio Ohno, Atsushi Umekawa, Takeo Hanashima, Hiroaki Hiramatsu
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Patent number: 11300456Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: November 15, 2019Date of Patent: April 12, 2022Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Publication number: 20220082447Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: November 22, 2021Publication date: March 17, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Patent number: 11198935Abstract: A heating part of covering and heating a gas pipe includes: a thermal insulation portion disposed outside a heat generation body; an enclosure configured to enclose the thermal insulation portion and the heat generation body; a fastening part installed outside the enclose and configured to fasten one end portion and the other end portion of the enclosure in a state in which the one end portion and the other end portion of the enclosure adjoin each other; and a temperature sensing part disposed at the side of the gas pipe with respect to the enclosure at a position facing a surface of the gas pipe and formed in a plate shape with a major surface thereof oriented toward the gas pipe.Type: GrantFiled: September 22, 2016Date of Patent: December 14, 2021Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Shinobu Sugiura, Yosuke Kuwata, Tomoyasu Miyashita, Atsushi Umekawa, Kazuhiro Kimura, Akihiko Hiratsuka, Kaoru Kataoka, Ryosuke Arai
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Patent number: 10998205Abstract: A substrate processing a technology including: a substrate holder; a tubular reactor that houses the substrate holder; an inlet flange connected to the tubular reactor including a plurality of gas introduction ports; a lid that closes a lower opening of the inlet flange in a manner such that the substrate holder can be carried in and out; heater elements disposed along the outer peripheral surface of the inlet flange while avoiding the gas introduction ports; temperature sensors thermally coupled to the inlet flange or any heater element and adapted to detect temperatures; and a temperature controller that divides of the heater elements into groups and controls power supply to the respective heater elements independently for each of the groups based on temperatures detection temperatures detected by the temperature sensors.Type: GrantFiled: September 13, 2019Date of Patent: May 4, 2021Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tomoyasu Miyashita, Daigi Kamimura, Atsushi Umekawa
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Publication number: 20200232097Abstract: There is provided a substrate processing apparatus including a process chamber defined at least by a reaction tube and a furnace opening part provided at a lower portion of the reaction tube; a nozzle provided at the furnace opening part and extending from the furnace opening part to an inside of the reaction tube; a gas supply system provided at an upstream side of the nozzle; a blocking part provided at a boundary between the gas supply system and the nozzle; and a controller configured to control the gas supply system and the blocking part such that the blocking part co-operates with the gas supply system to supply gases into the process chamber through the nozzle.Type: ApplicationFiled: March 27, 2020Publication date: July 23, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Mikio OHNO, Atsushi UMEKAWA, Takeo HANASHIMA, Hiroaki HIRAMATSU
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Patent number: 10684174Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: July 26, 2018Date of Patent: June 16, 2020Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Publication number: 20200166413Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: November 15, 2019Publication date: May 28, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Patent number: 10640872Abstract: There is provided a substrate processing apparatus including a process chamber defined at least by a reaction tube and a furnace opening part provided at a lower portion of the reaction tube; a nozzle provided at the furnace opening part and extending from the furnace opening part to an inside of the reaction tube; a gas supply system provided at an upstream side of the nozzle; a blocking part provided at a boundary between the gas supply system and the nozzle; and a controller configured to control the gas supply system and the blocking part such that the blocking part co-operates with the gas supply system to supply gases into the process chamber through the nozzle.Type: GrantFiled: December 7, 2018Date of Patent: May 5, 2020Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Mikio Ohno, Atsushi Umekawa, Takeo Hanashima, Hiroaki Hiramatsu
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Publication number: 20200090965Abstract: A substrate processing a technology including: a substrate holder; a tubular reactor that houses the substrate holder; an inlet flange connected to the tubular reactor including a plurality of gas introduction ports; a lid that closes a lower opening of the inlet flange in a manner such that the substrate holder can be carried in and out; heater elements disposed along the outer peripheral surface of the inlet flange while avoiding the gas introduction ports; temperature sensors thermally coupled to the inlet flange or any heater element and adapted to detect temperatures; and a temperature controller that divides of the heater elements into groups and controls power supply to the respective heater elements independently for each of the groups based on temperatures detection temperatures detected by the temperature sensors.Type: ApplicationFiled: September 13, 2019Publication date: March 19, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Tomoyasu MIYASHITA, Daigi KAMIMURA, Atsushi UMEKAWA
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Publication number: 20190106787Abstract: There is provided a substrate processing apparatus including a process chamber defined at least by a reaction tube and a furnace opening part provided at a lower portion of the reaction tube; a nozzle provided at the furnace opening part and extending from the furnace opening part to an inside of the reaction tube; a gas supply system provided at an upstream side of the nozzle; a blocking part provided at a boundary between the gas supply system and the nozzle; and a controller configured to control the gas supply system and the blocking part such that the blocking part co-operates with the gas supply system to supply gases into the process chamber through the nozzle.Type: ApplicationFiled: December 7, 2018Publication date: April 11, 2019Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Mikio OHNO, Atsushi UMEKAWA, Takeo HANASHIMA, Hiroaki HIRAMATSU
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Patent number: 10228291Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: February 24, 2016Date of Patent: March 12, 2019Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Publication number: 20180328790Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Publication number: 20180040488Abstract: A substrate processing apparatus, includes a reaction furnace, a preparatory chamber provided below the reaction furnace, an elevating mechanism configured to raise/lower a substrate holder between the reaction furnace and the preparatory chamber, a fluid circulation mechanism including a suction part for sucking a fluid within the preparatory chamber, a pipe part constituting a flow path through which the fluid flows from the suction part to a supply part, and a cooling mechanism, provided in the flow path, for cooling the fluid, and a control part for controlling the fluid circulation mechanism and the elevating mechanism to circulate the fluid sucked from the suction part through the flow path, and supply the fluid from the supply part to the preparatory chamber. The cooling mechanism is disposed adjacent to the suction part to cool the fluid introduced from the suction part before circulating the fluid through the flow path.Type: ApplicationFiled: August 2, 2017Publication date: February 8, 2018Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Toshiki FUJINO, Atsushi UMEKAWA, Takayuki NAKADA
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Patent number: 9646862Abstract: Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit.Type: GrantFiled: February 5, 2015Date of Patent: May 9, 2017Assignee: Hitachi Kokusai Electric, Inc.Inventors: Katsuyoshi Hamano, Atsushi Umekawa, Takuya Joda, Akinori Ishii, Masahisa Okuno
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Publication number: 20170107620Abstract: A heating part of covering and heating a gas pipe includes: a thermal insulation portion disposed outside a heat generation body; an enclosure configured to enclose the thermal insulation portion and the heat generation body; a fastening part installed outside the enclose and configured to fasten one end portion and the other end portion of the enclosure in a state in which the one end portion and the other end portion of the enclosure adjoin each other; and a temperature sensing part disposed at the side of the gas pipe with respect to the enclosure at a position facing a surface of the gas pipe and formed in a plate shape with a major surface thereof oriented toward the gas pipe.Type: ApplicationFiled: September 22, 2016Publication date: April 20, 2017Applicants: HITACHI KOKUSAI ELECTRIC INC., TOKYO TECHNOLOGICAL LABO CO., LTD.Inventors: Shinobu SUGIURA, Yosuke KUWATA, Tomoyasu MIYASHITA, Atsushi UMEKAWA, Kazuhiro KIMURA, Akihiko HIRATSUKA, Kaoru KATAOKA, Ryosuke ARAI
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Publication number: 20160245704Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: February 24, 2016Publication date: August 25, 2016Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Patent number: D901406Type: GrantFiled: September 9, 2019Date of Patent: November 10, 2020Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Toru Kagaya, Atsushi Umekawa