Abstract: A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure 100 comprises a first coil substrate 110 having a primary transformer coil part 41; a second coil substrate 120, disposed on the first coil substrate 110, having a secondary transformer coil part 42; and a transformer core 130 for magnetically connecting the transformer coil parts 41, 42 to each other. The coil substrates 110, 120 are disposed on each other while being shifted from each other such that the transformer coil parts 41, 42 overlap each other as seen in the substrate thickness direction. This can increase the heat dissipation area of the coil substrates 110, 120. The transformer coil parts 41, 42 have a width in a transmission direction A narrower than a width in a direction B intersecting the transmission direction A as seen in the substrate thickness direction. This can reduce the multilayer area of the coil substrates 110, 120 in the transmission direction A.

Abstract: A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure 100 comprises a first coil substrate 110 having a primary transformer coil part 41; a second coil substrate 120, disposed on the first coil substrate 110, having a secondary transformer coil part 42; and a transformer core 130 for magnetically connecting the transformer coil parts 41, 42 to each other. The coil substrates 110, 120 are disposed on each other while being shifted from each other such that the transformer coil parts 41, 42 overlap each other as seen in the substrate thickness direction. This can increase the heat dissipation area of the coil substrates 110, 120. The transformer coil parts 41, 42 have a width in a transmission direction A narrower than a width in a direction B intersecting the transmission direction A as seen in the substrate thickness direction. This can reduce the multilayer area of the coil substrates 110, 120 in the transmission direction A.

Abstract: Provided are a watertight plate where a resin is prevented from leaking and a power supply device including the same. In a base plate (watertight plate) of the present invention, when demarcating a channel by allowing a channel sidewall to contact with a cover plate, a resin is applied onto a second step portion of the channel sidewall to improve watertightness of the channel. The second step portion is closer to the channel and lower than a first step portion, which is a step portion in contact with the cover plate. Therefore, the movement of the resin applied onto the second step portion is prohibited by an edge surface of the step portion higher than the second step portion. Moreover, a resin lump of the resin applied onto the second step portion is housed within a third step portion which is closer to the channel and lower than the second step portion.

Abstract: Provided are a watertight plate where a resin is prevented from leaking and a power supply device including the same. In a base plate (watertight plate) of the present invention, when demarcating a channel by allowing a channel sidewall to contact with a cover plate, a resin is applied onto a second step portion of the channel sidewall to improve watertightness of the channel. The second step portion is closer to the channel and lower than a first step portion, which is a step portion in contact with the cover plate. Therefore, the movement of the resin applied onto the second step portion is prohibited by an edge surface of the step portion higher than the second step portion. Moreover, a resin lump of the resin applied onto the second step portion is housed within a third step portion which is closer to the channel and lower than the second step portion.

Abstract: A film comprises glass fiber impregnated with a low dielectric polymer obtained by polymerizing a monomeric composition comprising a fumaric acid diester monomer and optionally a vinyl monomer. The polymer having a low dielectric constant and reduced dielectric loss is used as an electrically insulating material in a high frequency band of at least 500 MHz.