Patents by Inventor Atsushi Yamatake

Atsushi Yamatake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat radiation structure for semiconductor device
    Patent number: 9293390
    Abstract: A semiconductor device with improved heat radiation and improved insulation performance. The semiconductor device includes a semiconductor element, a lead frame bonded on one surface to the semiconductor element, a first insulating layer disposed on the other surface of the lead frame, and a metal base plate connected to the lead frame with the first insulating layer interposed between them, wherein an outer peripheral portion of the first insulating layer is inside an outer peripheral portion of the metal base plate, and the outer peripheral portion of the first insulating layer is covered with a second insulating layer having higher moisture resistance and higher insulation performance than the first insulating layer, the outer peripheral portion including an electric field concentrated point in an outer peripheral portion of the lead frame.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: March 22, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroki Shiota, Atsushi Yamatake, Kenichi Suga, Yoshihiro Yamaguchi, Tetsuya Ueda
  • SEMICONDUCTOR DEVICE
    Publication number: 20150255370
    Abstract: A semiconductor device with improved heat radiation and improved insulation performance. The semiconductor device includes a semiconductor element, a lead frame bonded on one surface to the semiconductor element, a first insulating layer disposed on the other surface of the lead frame, and a metal base plate connected to the lead frame with the first insulating layer interposed between them, wherein an outer peripheral portion of the first insulating layer is inside an outer peripheral portion of the metal base plate, and the outer peripheral portion of the first insulating layer is covered with a second insulating layer having higher moisture resistance and higher insulation performance than the first insulating layer, the outer peripheral portion including an electric field concentrated point in an outer peripheral portion of the lead frame.
    Type: Application
    Filed: December 20, 2013
    Publication date: September 10, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroki Shiota, Atsushi Yamatake, Kenichi Suga, Yoshihiro Yamaguchi, Tetsuya Ueda