Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: There is provided an interior component for a vehicle including an impact absorbing member that is lightweight and compact while improving energy absorption efficiency in the event of a side collision. A side door component includes a door panel; a door trim attached to the door panel; and a protector disposed between the door panel and the door trim and attached to one of the door panel and the door trim. The protector has a bottom surface on which fixing portions attached to the one of the door panel and the door trim are formed, and a facing surface facing the other of the door panel and the door trim, and is attached to the one of the door panel and the door trim in a cantilever manner.

Abstract: A synchronizer ring 1 has an annular ring body 2; a friction material 4 joined integrally to a cylindrical inner peripheral surface 3 of the ring body 2; a conical surface 5 formed on an inner surface of the friction material 4; and a plurality of annular grooves 6 formed in the conical surface 5 of the friction material 4.

Abstract: A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a high ability to form a complexing ion with lead, and lead particles present on the surface of the lead-containing copper-based alloy are then removed. The complexing agent is one of an organic ammonium salt such as ammonium acetate, or ammonium citrate, or may be an organic sodium salt such as sodium acetate, sodium tartrate, and sodium citrate. Preferably, an immersion temperature of the alloy to the etching solution falls within a range of from 10 to 50° C. The etching solution is agitated with oxygen or a gas containing oxygen blown thereinto during the immersion of the alloy into the etching solution. An extremely low voltage of ?0.3 to +0.2 V vs. NHE is applied from outside to the lead-containing copper-based alloy as an anode.

Abstract: A synchronizer ring 1 has an annular ring body 2; a friction material 4 joined integrally to a cylindrical inner peripheral surface 3 of the ring body 2; a conical surface 5 formed on an inner surface of the friction material 4; and a plurality of annular grooves 6 formed in the conical surface 5 of the friction material 4.

Abstract: A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a high ability to form a complexing ion with lead, and lead particles present on the surface of the lead-containing copper-based alloy are then removed. The complexing agent is one of an organic ammonium salt such as ammonium acetate, or ammonium citrate, or may be an organic sodium salt such as sodium acetate, sodium tartrate, and sodium citrate. Preferably, an immersion temperature of the alloy to the etching solution falls within a range of from 10 to 50° C. The etching solution is agitated with oxygen or a gas containing oxygen blown thereinto during the immersion of the alloy into the etching solution. An extremely low voltage of −0.3 to +0.2 V vs. NHE is applied from outside to the lead-containing copper-based alloy as an anode.

Abstract: In a synchronizer ring that is a part of an automobile transmission, a ring body is made of an iron material and a sliding member is made of a wear-resistant copper alloy having the following chemical components, matrix and rigidity, characterized in that the ring body and sliding member are bonded to each other by way of hot working. (1) a wear-resistant copper alloy containing Zn of 22 to 45 wt %, at least one kind of metal elements of 0.1 to 15 wt % which are selected from a metal element group of Al, Mn, Fe, Pb, Ni, Be, Si, Co, Cr, Ti, Nb, V, Zr, Mo, Sn, Bi, B etc. and the remnant composed of Cu and impurities. (2) The wear-resistant copper alloy has a matrix of .alpha. phase+.beta. phase, .beta. phase alone or .beta. phase+.gamma. phase. (3) HRB (Hardness Rockwell B) value is more than 80.