Patents by Inventor Atsushi Yoneyama

Atsushi Yoneyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230228969
    Abstract: A mirror swing actuator assembly for an optical path folding element (OPFE) for compact folding camera modules comprises an exit aperture for outputting folded light rays, and an incoming aperture for receiving incoming light rays, wherein a distance between a top lens of a lens actuator and an end of the optical path folding element is minimized by configuring the second aperture and/or a support assembly of the optical path folding element to receive, within the mirror swing actuator assembly, an end portion of the optical actuator/lens assembly that comprises the top lens.
    Type: Application
    Filed: June 12, 2020
    Publication date: July 20, 2023
    Inventors: Naoki Sekiguchi, Atsushi Horidan, Atsushi Yoneyama, Irisawa Gentaro
  • Patent number: 11550117
    Abstract: A lens position adjustment device includes a lens holder, a first shape memory alloy (SMA) wire and a second SMA wire. The lens holder holds a lens. The first SMA wire is configured to move the lens holder in a first direction along an optical axis of lens. The second SMA wire is configured to move the lens holder in a second direction along the optical axis. The second direction is opposite to the first direction. The lens holder is moved in the first or second direction along the optical axis through energizing the first SMA wire and the second SMA wire and controlling a force that moves the lens holder.
    Type: Grant
    Filed: December 23, 2017
    Date of Patent: January 10, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Masaru Uno, Atsushi Yoneyama
  • Publication number: 20200386968
    Abstract: A lens position adjustment device includes a lens holder, a first shape memory alloy (SMA) wire and a second SMA wire. The lens holder holds a lens. The first SMA wire is configured to move the lens holder in a first direction along an optical axis of lens. The second SMA wire is configured to move the lens holder in a second direction along the optical axis. The second direction is opposite to the first direction. The lens holder is moved in the first or second direction along the optical axis through energizing the first SMA wire and the second SMA wire and controlling a force that moves the lens holder.
    Type: Application
    Filed: December 23, 2017
    Publication date: December 10, 2020
    Inventors: Masaru Uno, Atsushi Yoneyama
  • Patent number: 9389136
    Abstract: A calibration method of air pressure for a mobile device, a calibration device and a mobile device, where the calibration method includes acquiring self-location data of the mobile device; acquiring air pressure information from a web site or a web service according to the self-location data; performing calibration of air pressure for the mobile device by using the air pressure information. Through the embodiments of the present invention, dynamic calibration of air pressure is performed; furthermore, another barometer is not needed in the mobile device.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: July 12, 2016
    Assignee: Huawei Device Co., Ltd.
    Inventor: Atsushi Yoneyama
  • Publication number: 20140102169
    Abstract: A calibration method of air pressure for a mobile device, a calibration device and a mobile device, where the calibration method includes acquiring self-location data of the mobile device; acquiring air pressure information from a web site or a web service according to the self-location data; performing calibration of air pressure for the mobile device by using the air pressure information. Through the embodiments of the present invention, dynamic calibration of air pressure is performed; furthermore, another barometer is not needed in the mobile device.
    Type: Application
    Filed: December 23, 2013
    Publication date: April 17, 2014
    Applicant: HUAWEI DEVICE CO., LTD.
    Inventor: Atsushi Yoneyama
  • Patent number: 6565386
    Abstract: An electrical connector includes an insulative housing and a shielding plate attached to the housing. The housing includes a pair of locking arms extending from opposite ends thereof substantially along a direction along which the shielding plate is attached to the housing. The shielding plate includes opposite side portions engaging with the locking arms of the housing. Each locking arm of the housing has a protrusion. Each side portion of the shielding plate defines an opening engagingly receiving the protrusion of the locking arm therein.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: May 20, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Atsushi Yoneyama, Hung-Chi Yu
  • Patent number: 6449154
    Abstract: A retainer device for fixing a heat sink (2) on a chip (4) includes a mounting frame (31), a base plate (33) and a mounting lever (32). The heat sink has a number of upwardly extending cooling fins (21) and a pair of securing outwardly extending flanges (23). The mounting frame includes a pair of retaining plates (312) for pressing against the securing flanges and a pair of spring plates (311) connecting the retaining plates. The retaining plate defines a clip (318) for engaging with the heat sink and a latch 317 on each end thereof. The base plate defines four receiving projections (331), each of which defines a notch (332) for receiving the latch. The mouning lever defines a base pole (321) received between the cooling fins. The base pole defines at least one protrusion (323) for pressing against the spring plates and the securing flanges.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: September 10, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Atsushi Yoneyama, Hung-Chi Yu
  • Publication number: 20020085357
    Abstract: A retainer device for fixing a heat sink (2) on a chip (4) includes a mounting frame (31), a base plate (33) and a mounting lever (32). The heat sink has a number of upwardly extending cooling fins (21) and a pair of securing outwardly extending flanges (23). The mounting frame includes a pair of retaining plates (312) for pressing against the securing flanges and a pair of spring plates (311) connecting the retaining plates. The retaining plate defines a clip (318) for engaging with the heat sink and a latch 317 on each end thereof. The base plate defines four receiving projections (331), each of which defines a notch (332) for receiving the latch. The mouning lever defines a base pole (321) received between the cooling fins. The base pole defines at least one protrusion (323) for pressing against the spring plates and the securing flanges.
    Type: Application
    Filed: April 10, 2001
    Publication date: July 4, 2002
    Inventors: Atsushi Yoneyama, Hung-Chi Yu
  • Patent number: 6383039
    Abstract: An electrical connector (1) includes an insulative housing (2) and a number of conductive contacts (3). The insulative housing defines a number of receiving passageways (20) for receiving the conductive contacts. The receiving passageways each comprise a pair of opposite side walls (21) and an upper wall (22) between the side walls. Each side wall defines a mounting channel (23). The conductive contact includes a retaining portion (31), a mating portion (33) extending forwardly from the retaining portion and a tail portion (32) extending rearwardly from the retaining portion. The retaining portion and the mating portion are both received in the receiving passageway. The mounting portion forms a pair of opposite mounting shoulders (34) received in the mounting channels and a number of barbs (37) for engaging with the side walls. The contact forms a number of projections (35) for interference fitting with the upper wall of the receiving passageway.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: May 7, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Atsushi Yoneyama, Hung-Chi Yu
  • Patent number: 6371772
    Abstract: An electrical connector includes an insulative housing (30) and a plurality of contacts (10). The housing has a plurality of cavities (36) arranged in two vertical stacks (54, 56), each stack being separated by thin walls (34) of the housing. Each contact has a main body (11), a contact portion (12) for mating with a mating connector, and a mounting member (15) extending perpendicularly from the main body. The mounting member protrudes from a bottom surface (46) of the housing. A plate-like support finger (18) extends obliquely from the main body. The support finger has a suspending end (19) parallel to the main body and extending toward the mounting member. The suspending end bears against a lower wall of the corresponding cavity, thereby preventing the main body from moving downwardly relative to the contact.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: April 16, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Atsushi Yoneyama, Hung-Chi Yu
  • Patent number: 6343017
    Abstract: A heat sink assembly for use with an electronic IC chip (4) includes a socket (30), a heat sink (2), a pair of mounting clips (32) and a pair of retention modules (31). The heat sink abuts against the chip and has a plurality of cooling fins (21) extending upwardly from a base (20) and a pair of securing flanges (22) extending outwardly from the base. Each retention module defines a protrusion (313) on a first sidewall (311) and a latch (314) on a second sidewall (312). Each mounting clip forms a base member (320) defining two apertures (327) for receiving the protrusions. An arm (321) with a notch (325) defined on a free end thereof is formed at either lateral end of the base member for engaging with the latches. A retaining clip (322) extends downwardly and inwardly from the mounting clip for pressing against the securing flange.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: January 29, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hung-Chi Yu, Atsushi Yoneyama
  • Patent number: D453735
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: February 19, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Atsushi Yoneyama, Hung-Chi Yu