Patents by Inventor Atsusi Matsuda

Atsusi Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7221340
    Abstract: Provided is a self light emitting type display device which can correct variations in characteristics of self-emitting elements arranged in a display panel, a driver IC which drives lighting of the self-emitting elements, and the like. A self-emitting module 1 is composed of a display panel 2 on which a plurality of self-emitting elements are arranged, a flexible circuit board 3 whose one end portion is connected with the display panel, a memory 10 which is loaded on the circuit board 3 and in which data for adjusting light emission intensities of the self-emitting elements is stored, and a drive unit 5 which is loaded also on the circuit board and which is equipped with a function of generating the drive current which is for adjusting the light emission intensities of the respective light emitting elements based on the data stored in the memory.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: May 22, 2007
    Assignee: Tohoku Pioneer Corporation
    Inventors: Atsusi Matsuda, Yoichi Satake
  • Patent number: 7193157
    Abstract: A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: March 20, 2007
    Assignee: Tohoku Pioneer Corporation
    Inventors: Atsusi Matsuda, Hidetaka Ohazama
  • Publication number: 20060214569
    Abstract: It is an object of the invention to avoid a contact between desiccating member(s) provided within a cover and an organic EL laminated body. An organic EL panel includes a substrate and an organic EL laminated body formed on the substrate. The organic EL laminated body includes a first electrode, an organic layer, and a second electrode, laminated one above another, with the organic layer interposed between the pair of electrodes, thereby forming an organic EL device. Further, a cover is bonded to the substrate by virtue of an adhesive agent, thereby covering the organic EL laminated body with the cover so as to protect the same from the outside air. Moreover, a desiccating member is provided within the cover 16 and separated from the organic EL laminated body. A concave portion U is formed on the exposed side (facing the organic EL laminated body) of the desiccating member.
    Type: Application
    Filed: June 2, 2006
    Publication date: September 28, 2006
    Inventors: Isamu Ohshita, Takemi Naito, Atsusi Matsuda
  • Publication number: 20050039945
    Abstract: A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.
    Type: Application
    Filed: July 30, 2004
    Publication date: February 24, 2005
    Inventors: Atsusi Matsuda, Hidetaka Ohazama
  • Publication number: 20040252086
    Abstract: Provided is a self light emitting type display device which can correct variations in characteristics of self-emitting elements arranged in a display panel, a driver IC which drives lighting of the self-emitting elements, and the like.
    Type: Application
    Filed: May 18, 2004
    Publication date: December 16, 2004
    Applicant: TOHOKU PIONEER CORPORATION
    Inventors: Atsusi Matsuda, Yoichi Satake
  • Publication number: 20040191568
    Abstract: It is an object of the invention to avoid a contact between desiccating member(s) provided within a cover and an organic EL laminated body. An organic EL panel includes a substrate and an organic EL laminated body formed on the substrate. The organic EL laminated body includes a first electrode, an organic layer, and a second electrode, laminated one above another, with the organic layer interposed between the pair of electrodes, thereby forming an organic EL device. Further, a cover is bonded to the substrate by virtue of an adhesive agent, thereby covering the organic EL laminated body with the cover so as to protect the same from the outside air. Moreover, a desiccating member is provided within the cover 16 and separated from the organic EL laminated body. A concave portion U is formed on the exposed side (facing the organic EL laminated body) of the desiccating member.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 30, 2004
    Applicant: Tohoku Pioneer Corporation
    Inventors: Isamu Ohshita, Takemi Naito, Atsusi Matsuda