Patents by Inventor Atsusi Nakamura

Atsusi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5929778
    Abstract: A data carrier system allows data to be transmitted and received. The data is transmitted using weak radio waves of suitable frequencies, such as frequencies in a high frequency band (HF) or a very high frequency band (VHF). The transmitters and receivers need not physically contact each other, be located in any particular position, or be oriented in any particular direction. The data carrier system does not suffer deficiencies in electric power supply, and therefore there exists no need to exchange batteries. Individual transmitters and receivers are positively discriminated one from another. The receivers are in the form of a plurality of tags. The transmitters are in the form of a plurality of reader-writers. Both are controlled by microcomputers, and each tag is equipped with a secondary battery as the power source.
    Type: Grant
    Filed: November 9, 1995
    Date of Patent: July 27, 1999
    Assignees: Rikagaku Kenkyusho, Sigma Systems Co., Ltd.
    Inventors: Hajime Asama, Hayato Kaetsu, Shin-ya Kotosaka, Isao Endo, Sakae Miyao, Atsusi Nakamura
  • Patent number: 5200366
    Abstract: In a resin mold semiconductor device in which a chip is mounted to a substrate and one of its main planes is molded by a resin member by pressure molding, and in a molding apparatus therefor, a gate of a mold is formed in such a manner as to extend towards a radial center of wires inside a cavity so that the resin injected under pressure from a gate of the molding apparatus into the cavity flows in a radial direction along the wires and air vents are opened at the remotest positions of the cavity from the gate. Accordingly, there can be obtained a semiconductor device in which a gate trace is positioned on the upper surface of the resin member and on a vertical line passing through the radial center of leads formed radially on the substrate.
    Type: Grant
    Filed: April 26, 1991
    Date of Patent: April 6, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Tomio Yamada, Hiroi Oka, Atsusi Nakamura, Kunihiko Nishi, Kazuo Yamazaki, Kouzi Koizumi, Junichi Saeki