Patents by Inventor Atsusi Sakaida

Atsusi Sakaida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7296340
    Abstract: The present invention provides a recycler that recycles a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. The insulating body base of the printed circuit board as the waste printed circuit board can be a thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. The recycler includes a pressuring device that pressurizes the waste printed circuit board, a heater that heats the waste printed circuit board to a predetermined temperature at which the waste printed circuit board is at least softened, and a filter that filters the resin material from the waste printed circuit board. The heater can be maintain the filter at the predetermined temperature provided by the heater.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: November 20, 2007
    Assignee: DENSO CORPORATION
    Inventors: Atsusi Sakaida, Toshihisa Taniguchi
  • Patent number: 7107661
    Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: September 19, 2006
    Assignee: Denso Corporation
    Inventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kond, Atsusi Sakaida, Toshihisa Taniguchi
  • Publication number: 20050246879
    Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.
    Type: Application
    Filed: July 21, 2005
    Publication date: November 10, 2005
    Inventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kondo, Atsusi Sakaida, Toshihisa Taniguchi
  • Publication number: 20040111854
    Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.
    Type: Application
    Filed: March 26, 2003
    Publication date: June 17, 2004
    Inventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kondo, Atsusi Sakaida, Toshihisa Taniguchi