Abstract: An interconnect substrate includes a first interconnect substrate having a first electrode on a first surface and having a recess formed in an edge in a plan view normal to the first surface, a second interconnect substrate having a second electrode on a second surface facing toward the first surface, a connector disposed inside the recess and electrically connected to the first interconnect substrate, an intermediate substrate disposed between the first interconnect substrate and the second interconnect substrate, the intermediate substrate including an insulating base and a conductive via, the insulating base having a through hole extending from a third surface facing the first surface to a fourth surface facing the second surface, the conductive via being disposed in the through hole, a first conductive member electrically connecting the first electrode and the conductive via, and a second conductive member electrically connecting the second electrode and the conductive via.

Abstract: A measuring device includes a substrate having a first surface and a second surface on an opposite side from the first surface, a first electrode and a second electrode provided on the substrate, a heat-sensitive portion, provided on the first surface, and configured to detect heat of a substance that makes contact with the first surface, a temperature sensor provided on the second surface, and a heat transfer member, penetrating the substrate, and configured to transfer heat of the heat-sensitive portion to the temperature sensor.

Abstract: A sensor module includes a metal member having a side surface extending in a ring shape, and a recess recessed from the side surface and extending in a ring shape along the side surface, a resin part filling an inside of the recess, a radiating part provided in the resin part and configured to emit radio waves, a radio communication device provided in the resin part and electrically connected to the radiating part, and a sensor electrically connected to the radio communication device. The metal member is insulated from the radiating part by the resin part, and functions as a passive element.

Abstract: An electronic device includes a support body, a wiring substrate, a light emitting element, and a light receiving element. The support body includes first and second planar portions facing each other, a connecting portion connecting basal ends of the planar portions, and a receptacle. The wiring substrate is attached along an outer peripheral surface of the support body, folded at a distal end of each planar portion, and attached along an inner peripheral surface of the planar portion. The light emitting element is mounted on a first surface of the wiring substrate at a portion attached along the inner peripheral surface of the first planar portion. The light receiving element is mounted on the first surface of the wiring substrate at a portion attached along the inner peripheral surface of the second planar portion so that the light receiving element faces the light emitting element.

Abstract: A sensor module includes a ring-shaped member; and a semiconductor device that is provided on the ring-shaped member. The semiconductor device includes: a wiring substrate that has flexibility; and electronic components that are mounted on the wiring substrate. The wiring substrate has component mounting regions, wherein at least one electronic component is mounted in each of the component mounting regions, and component non-mounting regions, wherein no electronic component is mounted in each of the component non-mounting regions. The component mounting regions and the component non-mounting regions are provided alternately in a longitudinal direction of the wiring substrate. The component non-mounting regions are curved along an outer circumferential direction of the ring-shaped member.

Abstract: An electronic device includes a support body, a wiring substrate, a light emitting element, and a light receiving element. The support body includes first and second planar portions facing each other, a connecting portion connecting basal ends of the planar portions, and a receptacle. The wiring substrate is attached along an outer peripheral surface of the support body, folded at a distal end of each planar portion, and attached along an inner peripheral surface of the planar portion. The light emitting element is mounted on a first surface of the wiring substrate at a portion attached along the inner peripheral surface of the first planar portion. The light receiving element is mounted on the first surface of the wiring substrate at a portion attached along the inner peripheral surface of the second planar portion so that the light receiving element faces the light emitting element.

Abstract: A sensor module includes a ring-shaped member; and a semiconductor device that is provided on the ring-shaped member. The semiconductor device includes: a wiring substrate that has flexibility; and electronic components that are mounted on the wiring substrate. The wiring substrate has component mounting regions, wherein at least one electronic component is mounted in each of the component mounting regions, and component non-mounting regions, wherein no electronic component is mounted in each of the component non-mounting regions. The component mounting regions and the component non-mounting regions are provided alternately in a longitudinal direction of the wiring substrate. The component non-mounting regions are curved along an outer circumferential direction of the ring-shaped member.