Abstract: A electrical interconnection device for receiving and holding a plurality of electrical contacts. The electrical interconnection device includes a metal support substrate having an array of contact receiving apertures extending therethrough. Each of the contact receiving apertures is defined by an aperture wall and the contact receiving apertures are adapted to receive the plurality of electrical contacts. The electrical interconnection device also includes a dielectric layer coating the aperture wall. The dielectric layer insulates the plurality of electrical contacts from the substrate.

Abstract: An electrical device carrier contact assembly for installation on a circuit board is disclosed. The contact assembly includes a first electrical contact having a first mounting portion and a first receptacle contact portion; a second electrical contact having a second mounting portion and a second receptacle contact portion; and an electrical device secured to the first mounting portion and to the second mounting portion. The electrical device carrier contact assembly is configured to be manipulated and installed on the circuit board as a single unit. A PCB assembly includes a PCB and the electrical device carrier contact assembly inserted by an insertion tool.

Abstract: An electrical connector including a housing having a mating interface and a contact interface configured to receive an end of a flexible printed circuit (FPC) having at least one row of FPC contacts, and contacts received in the housing and extending between the mating interface and the contact interface. Each of the contacts being configured to engage a corresponding one of the FPC contacts. An insert member is received within the housing. The insert member includes individual fingers moving independently with respect to one another, and the insert member is configured to be loaded into the housing to a mated position at which each of the fingers separately engage the FPC.

Abstract: A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.

Abstract: A socket connector for an electronic package includes a socket housing and a loading caddy having a forward end and a rearward end. The forward end includes an opening dimensioned to receive the electronic package. The loading caddy is coupled to the housing for linear and rotational movement therewith. The loading caddy rotates through a first range of motion adapted to align the electronic package with respect to the housing, and descends linearly through a second range of motion to load the electronic package into the housing.

Abstract: An electrical connector is provided that includes a socket housing holding an array of electrical contacts and a load plate rotatably coupled to the housing and rotatable between an open position and a closed position. The load plate includes a channel that is configured to receive an electronic package when the load plate is in the open position. The load plate loads the package into the housing as the load plate is rotated to the closed position.

Abstract: A memory module electrical connector is comprised of an insulative housing and a plurality of electrical terminals. The terminals are stamped and formed from conductive material to include resilient contact portions for interconnection to the module, and compliant pin portions for interconnection to the printed circuit board. The compliant pin portions of the connector are laterally staggered, with some compliant pin portions being positioned adjacent to a slot in the housing for receiving the memory module, and alternate contacts are positioned distant from the slot, thereby staggering the compliant pin portions. The compliant pin sections include an upstanding, rigidifying section to rigidify the compliant pin portion during the insertion of the electrical connector and the plurality of compliant pin portions into the printed circuit board.

Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.

Abstract: An electrical socket is provided that holds an array of contacts. Each contact includes first and second contact elements that are configured to be joined in an electrically common manner. The first and second contact elements have first and second contact beams, respectively, that are oriented to project toward one another and to overlap. The first and second contact elements each have base portions that are formed separate from one another and are configured to be joined to a common conductive path on the circuit board.

Abstract: An electrical contact is provided that includes a body configured to be held on a circuit board. The body of the contact is movable relative to the circuit board along at least a first axis of motion. The contact includes a contact portion joined with the body that is configured to engage an electrical component. The contact portion may include one or more contact beams. The contact further includes a termination lead joined to the body and having an outer end that is configured to be soldered to the circuit board. The termination lead extends from the body at an acute or right angle to the first axis of motion. The termination lead flexes about an arcuate path as the body of the contact shifts along the first axis of motion with respect to the circuit board.