Abstract: A sensor system includes a receiver circuit including a receiver electrode, a transmitter electrode, and control logic. The control logic is configured to determine that an amplitude of a transmitter electrode output signal is greater than an amplitude threshold. Based on this determination, the control logic is configured to whether a frequency of the transmitter electrode output signal is within an allowed frequency range. Based on a determination that the frequency of the transmitter electrode output signal is not within the allowed frequency range, the control logic is configured to determine that noise is present in the system.

Abstract: A sensor system includes a receiver circuit including a receiver electrode, a transmitter electrode, and control logic. The control logic is configured to determine that an amplitude of a transmitter electrode output signal is greater than an amplitude threshold. Based on this determination, the control logic is configured to whether a frequency of the transmitter electrode output signal is within an allowed frequency range. Based on a determination that the frequency of the transmitter electrode output signal is not within the allowed frequency range, the control logic is configured to determine that noise is present in the system.

Abstract: A proximity-activated gesture circuit includes an activation receiver electrode, a transmitter electrode, additional receiver electrodes, a control circuit, and a signal processor circuit. The control circuit is configured to activate the transmitter electrode and additional receiver electrodes when a capacitance measurement by the activation receiver electrode reaches a threshold. The signal processor circuit is configured to interpret measurements from the additional receiver electrodes as a gesture.

Abstract: A receiver stage of a sensor system includes a receiver electrode and a loop filter. The loop filter is configured to activate electrical oscillation and thus the receiver stage when a capacitance measurement reaches a threshold and issue the capacitance measurement upon activation of the receiver stage. The capacitance measurement includes capacitance with respect to an inactive transmitter electrode.

Abstract: Improved signal-to-noise performance of projected capacitance touch screens and panels is provided by an integrated circuit regulated high voltage source and high voltage/current drivers coupled to a plurality of projected capacitive touch elements that are controlled by a microcontroller. The single integrated circuit high voltage generator/driver may comprise a voltage boost circuit, a voltage reference, power-on-reset (POR), soft start, a plurality of voltage level shifters and a serial interface for coupling to the microcontroller that may control all functions related to using the projected capacitance touch screens and panels.

Abstract: A receiver stage of a sensor system includes a receiver electrode and a loop filter. The loop filter is configured to activate electrical oscillation and thus the receiver stage when a capacitance measurement reaches a threshold and issue the capacitance measurement upon activation of the receiver stage. The capacitance measurement includes capacitance with respect to an inactive transmitter electrode.

Abstract: A proximity-activated gesture circuit includes an activation receiver electrode, a transmitter electrode, additional receiver electrodes, a control circuit, and a signal processor circuit. The control circuit is configured to activate the transmitter electrode and additional receiver electrodes when a capacitance measurement by the activation receiver electrode reaches a threshold. The signal processor circuit is configured to interpret measurements from the additional receiver electrodes as a gesture.

Abstract: Improved signal-to-noise performance of projected capacitance touch screens and panels is provided by an integrated circuit regulated high voltage source and high voltage/current drivers coupled to a plurality of projected capacitive touch elements that are controlled by a microcontroller. The single integrated circuit high voltage generator/driver may comprise a voltage boost circuit, a voltage reference, power-on-reset (POR), soft start, a plurality of voltage level shifters and a serial interface for coupling to the microcontroller that may control all functions related to using the projected capacitance touch screens and panels.

Abstract: Improved signal-to-noise performance of projected capacitance touch screens and panels is provided by an integrated circuit regulated high voltage source and high voltage/current drivers coupled to a plurality of projected capacitive touch elements that are controlled by a microcontroller. The single integrated circuit high voltage generator/driver may comprise a voltage boost circuit, a voltage reference, power-on-reset (POR), soft start, a plurality of voltage level shifters and a serial interface for coupling to the microcontroller that may control all functions related to using the projected capacitance touch screens and panels.

Abstract: Improved signal-to-noise performance of projected capacitance touch screens and panels is provided by an integrated circuit regulated high voltage source and high voltage/current drivers coupled to a plurality of projected capacitive touch elements that are controlled by a microcontroller. The single integrated circuit high voltage generator/driver may comprise a voltage boost circuit, a voltage reference, power-on-reset (POR), soft start, a plurality of voltage level shifters and a serial interface for coupling to the microcontroller that may control all functions related to using the projected capacitance touch screens and panels.

Abstract: Embodiments of the invention relate to a package design incorporating an ultra-low characteristic impedance transmission line (T-line) bundle. The T-line bundle can extend from inside the package to outside the package in order to provide power delivery and power interconnect for a chip. In one embodiment, the T-line bundle can be attached at the die. In another embodiment, the T-line bundle can be attached to the package substrate. The T-line bundle can be a stack of parallel planar transmission line strips in a periodic pattern where the dielectric material of the strips can be a high-k dielectric and can be flexible, semi-rigid, or precision rigid.