Patents by Inventor Atuhito Mizutani

Atuhito Mizutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrode pad section for external connection
    Patent number: 7391114
    Abstract: A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal (61) formed in the top layer, a second pad metal (62) formed under the first pad metal (61) via an interlayer insulating film (71), and vias (63) which penetrate the interlayer insulating film (71) and electrically connect the first pad metal (61) and the second pad metal (62). The first pad metal (61) and the second pad metal (62) have edges displaced from each other so as not to be aligned with each other along the thickness direction of each layer. Thus, it is possible to reduce stress occurring on an edge of the second pad metal (62), thereby reducing damage on the interlayer insulating film (71) and so on.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: June 24, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadaaki Mimura, Tsuyoshi Hamatani, Atuhito Mizutani, Kenji Ueda
  • Semiconductor device
    Publication number: 20050173801
    Abstract: A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal (61) formed in the top layer, a second pad metal (62) formed under the first pad metal (61) via an interlayer insulating film (71), and vias (63) which penetrate the interlayer insulating film (71) and electrically connect the first pad metal (61) and the second pad metal (62). The first pad metal (61) and the second pad metal (62) have edges displaced from each other so as not to be aligned with each other along the thickness direction of each layer. Thus, it is possible to reduce stress occurring on an edge of the second pad metal (62), thereby reducing damage on the interlayer insulating film (71) and so on.
    Type: Application
    Filed: February 1, 2005
    Publication date: August 11, 2005
    Applicant: Matsushita Elec. Ind. Co. Ltd.
    Inventors: Tadaaki Mimura, Tsuyoshi Hamatani, Atuhito Mizutani, Kenji Ueda