Patents by Inventor Atul Kumar Verma

Atul Kumar Verma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for heat transfer simulations
    Patent number: 10354027
    Abstract: Systems and methods are provided for heat transfer simulations. Mesh generation is performed for a plurality of regions. Mesh faces are determined on different sides of an interface between the regions and overlapping areas between the determined mesh faces are determined. A total heat flow associated with the interface is discretized based at least in part on the one or more overlapping areas for heat transfer simulations.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: July 16, 2019
    Assignee: Ansys, Inc.
    Inventors: Atul Kumar Verma, Sudhanshu Kishore Prasad
  • Method and materials for bonding electrodes to interconnect layers in solid oxide fuel cell stacks
    Patent number: 7645535
    Abstract: A method and related bonding compositions for use in assembling a solid oxide fuel cell (“SOFC”) stack having thermally and chemically stable and electrically conductive bonds between alternating fuel cells and interconnect components in the stack. The improved method and materials allow for the assembly of solid oxide fuel cells having a stronger and more reliable bond with good electrical contact in situ between the SOFC interconnect layers (plates) and the electrodes. The bonding materials and method according to the invention provide good electrical performance while maintaining the mechanical and electrical integrity of SOFC stacks without requiring excessive mechanical compression of the stack as exemplified by prior art systems.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: January 12, 2010
    Assignee: General Electric Company
    Inventors: Timothy Joseph Rehg, Jie Guan, Kurtis C. Montgomery, Atul Kumar Verma, Gregory Robert Lear
  • Solid Oxide Electrochemical Devices Having a Dimensionally Stable Bonding Agent to Bond an Anode to Anode Interconnect and Methods
    Publication number: 20090260223
    Abstract: A solid oxide electrochemical device having improved mechanical integrity comprising a bonding agent for physically and electrically bonding an anode to an anode interconnect, the bonding agent comprising a particulate metal, wherein the bonding agent is substantially chemically inert during operation of the solid oxide electrochemical device. A method for bonding an anode and an anode interconnect to be used in a solid oxide electrochemical device.
    Type: Application
    Filed: June 29, 2009
    Publication date: October 22, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Atul Kumar Verma, Shekhar Shripad Kamat
  • Solid Oxide Electrochemical Devices Having an Improved Electrode
    Publication number: 20090011323
    Abstract: An electrode with improved resistance to Cr poisoning comprising AxB3-xO4, wherein A is selected from the group consisting of Mn, Co, Fe, Cr, Cu, V, and Ni and B is selected from the group consisting of Mn, Co, Fe, Cr, Cu, V, and Ni and a solid oxide electrochemical device comprising the same. A method for making a solid oxide electrochemical device comprising the above-described electrode.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Jie Guan, Rajiv Doshi, Atul Kumar Verma