Patents by Inventor Atunobu Kawamoto

Atunobu Kawamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas
    Patent number: 5532517
    Abstract: A hybrid integrated circuit device having a conductor foil pattern connected to a connector lead with increased mechanical strength. A heat conduction suppressing element, such as an opening, is located in the vicinity of a soldered bond to the conductor foil pattern of a metallic circuit substrate having a high thermal conductivity and a connector lead for reducing heat conduction to the substrate during soldering. The bond formed between the conductor foil pattern and the connector lead has remarkably improved bonding quality and mechanical strength.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: July 2, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Atunobu Kawamoto