Abstract: A semiconductor device with improved reliability is provided. The semiconductor device in a QFN package configuration has a semiconductor chip mounted on a tab, leads which are alternately arranged around the tab and electrically connected to the electrodes of the semiconductor chip via bonding wires, and an encapsulating resin portion for encapsulating therein the semiconductor chip and the bonding wires. The lower exposed surfaces of the leads are exposed at the outer peripheral portion of the back surface of the encapsulating resin portion to form external terminals. The lower exposed surfaces of the leads are exposed at the portion of the back surface of the encapsulating resin portion which is located inwardly of the lower exposed surface of the leads to also form external terminals.

Abstract: A grommet is mounted into an opening formed in a mating member after a wire harness containing a plurality of wires tied up in a bundle is inserted through the grommet. The grommet has a base portion formed of rubber or resin and has in the annular outer peripheral wall thereof a mounting groove fittable with an opening edge of the mating member, a roof portion extending inwardly from the opening end of the base portion, a medium diameter portion formed in a cylindrical shape having an inside diameter larger than the diameter of the wire harness to be inserted therethrough and extending upwardly in the axial direction of the grommet from the roof portion, and a small diameter portion reducing continuously in diameter from the opening end of the medium diameter portion and extending further upwardly in the axial direction of the grommet in a cylindrical manner.

Abstract: A grommet which is used to protect a wire harness in a through portion formed in a vehicle body and the like. The grommet includes a base portion formed of rubber and having a mounting groove fittable with an opening edge of a mating member, a roof portion extending inwardly from the opening end of the base portion, and a guide portion extending in a cylindrical shape in the axial direction of the grommet from the inner end of the roof portion. In the grommet, a ring-shaped cavity is formed in the inner wall portion of the grommet extending from the base portion to the roof portion, and an annular cavity is formed in the inner peripheral wall of the base portion corresponding to the position of the mounting groove.