Patents by Inventor Atushi Sakaida

Atushi Sakaida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluid material filling apparatus and related filling methods
    Patent number: 6695020
    Abstract: A vacuum pump depressurizes a scavenging chamber to discharge the air or gas residing in a via hole. Then, a paste chamber provided adjacent to the scavenging chamber moves on the scavenged via hole. A squeezing unit provided in the paste chamber pushes a conductive paste into the via hole. Keeping the inside space of the via hole in a depressurized condition is effective to let the conductive paste enter deeply into the via hole. The inside space of the via hole is entirely filled with the conductive paste.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: February 24, 2004
    Assignee: Denso Corporation
    Inventors: Atushi Sakaida, Toshihisa Taniguchi
  • Fluid material filling apparatus and related filling method
    Publication number: 20030066572
    Abstract: A vacuum pump depressurizes a scavenging chamber to discharge the air or gas residing in a via hole. Then, a paste chamber provided adjacent to the scavenging chamber moves on the scavenged via hole. A squeezing unit provided in the paste chamber pushes a conductive paste into the via hole. Keeping the inside space of the via hole in a depressurized condition is effective to let the conductive paste enter deeply into the via hole. The inside space of the via hole is entirely filled with the conductive paste.
    Type: Application
    Filed: October 9, 2002
    Publication date: April 10, 2003
    Inventors: Atushi Sakaida, Toshihisa Taniguchi