Patents by Inventor Audi Chen

Audi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package based on window pad type of leadframe and method of fabricating the same
    Patent number: 6440779
    Abstract: A new semiconductor packaging technology is proposed for the fabrication of a semiconductor package based on window pad type of leadframe. The proposed semiconductor packaging technology is characterized by the mounting of a window shim having a solid ring portion and a hollowed window portion over the die pad of the leadframe. The window shim is dimensioned in such a manner that the width of the ring portion thereof is larger than the width of the window portion of the die pad of the leadframe, while the width of the window portion of the window shim is smaller than the width of the semiconductor chip. This feature allows one design of the window pad type of leadframe to be universally suited for packaging semiconductor chips of various sizes. Moreover, the incorporation of the window shim additionally allows an increase in the heat-dissipation efficiency of the packaged chip.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: August 27, 2002
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Fly Chiu, Audi Chen, Tzong-Da Ho