Abstract: An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material substrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. Removal effectiveness may be enhanced by utilizing polarized energetic photons. Directing a laser beam to the back side of a transparent substrate may enhance the effectiveness of removal.

Abstract: An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material substrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. Removal effectiveness may be enhanced by utilizing polarized energetic photons. Directing a laser beam to the back side of a transparent substrate may enhance the effectiveness of removal.

Abstract: An apparatus and method for removing surface contaminants from a surface of a substrate provides a laminar flow of inert gas over the substrate surface while irradiating the substrate. The invention enables removal of surface contaminants without altering the underlying molecular crystal structure of the substrate. The source of high-energy irradiation includes a pulsed or continuous wave laser or high-energy lamp.

Abstract: An apparatus and method for removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material substrate surface while irradiating the undesired material with energetic photons directed at an angle that is oblique to the substrate. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. In certain circumstances, the non-perpendicular incidence permits effective removal where normal incidence caused damage to the substrate or poor removal or both.

Abstract: An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material substrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. The invention can be applied to produce changes in surface topography (including nano-structuring and surface planarization).

Abstract: An apparatus for removing surface contaminants from a planar or irregularly shaped surface of a substrate by high-energy irradiation is provided. The invention enables removal of surface contaminants without altering the underlying molecular crystal structure of the substrate. The source of high-energy irradiation includes a pulsed or continuous wave laser or high-energy lamp.

Abstract: A method and apparatus for removing surface contaminants from the surface of a substrate by high-energy irradiation is provided. The invention enables removal of surface contaminants without altering of the substrate's underlying molecular structure. The source of high-energy irradiation may comprise a pulsed laser.

Abstract: A method and apparatus for removing surface contaminants from the surface of a substrate by high-energy irradiation is provided. The invention enables removal of surface contaminants without altering of the substrate's underlying molecular structure. The source of high-energy irradiation may comprise a pulsed laser.