Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: A decorated particle comprises a single inorganic particle core having an uneven outer surface with a plurality of crevices and an average particle diameter of 20 to 150 microns. A binder retaining decorating particles is disposed on at least a portion of the outer surface of the inorganic particle core and fills the crevices. The decorating particles have an average particle diameter of 0.05 to 10 microns. A method of making decorated particles is also disclosed.

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

Abstract: Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

Abstract: Reaction mixtures, foams prepared from the reaction mixtures, articles containing the foams, and methods of making the foams are provided. The polymeric material in the foam is formed from a polymerizable composition that includes a di(meth)acrylate oligomer and a monomer having a single ethylenically unsaturated group. The foams are highly filled (e.g., at least 60 volume percent of the foam is the filler) and can be thermally conductive. Although the foams contain a large amount of filler, the foams can be compressed at least 40 volume percent with an applied pressure of 50 pounds per square inch (345 kiloPascals).

Abstract: Reaction mixtures, foams prepared from the reaction mixtures, articles containing the foams, and methods of making the foams are provided. The polymeric material in the foam is formed from a polymerizable composition that includes a di(meth)acrylate oligomer and a monomer having a single ethylenically unsaturated group. The foams are highly filled (e.g., at least 60 volume percent of the foam is the filler) and can be thermally conductive. Although the foams contain a large amount of filler, the foams can be compressed at least 40 volume percent with an applied pressure of 50 pounds per square inch (345 kiloPascals).

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.