Abstract: Implementations of the present disclosure are directed to an injection device including a medicament reservoir configured to store a medicament to be expelled by the injection device, and an acoustic source configured to generate an acoustic signal including information indicative of an amount of the medicament stored in the medicament reservoir. The acoustic signal is transmitted to an external device configured to process the acoustic signal and to extract injection device data.

Abstract: Implementations of the present disclosure are directed to an injection device (102) including a medicament reservoir (103) configured to store a medicament to be expelled by the injection device (102), an acoustic source (122a, 122b, 122c, 122d, 200, 300, 400) configured to generate an acoustic signal including information indicative of an amount of the medicament stored in the medicament reservoir (103), the acoustic signal being transmitted to an external device (104) configured to process the acoustic signal and to extract injection device data.

Abstract: Implementations of the present disclosure are directed to an injection device including a medicament reservoir configured to store a medicament to be expelled by the injection device, and an acoustic source configured to generate an acoustic signal including information indicative of an amount of the medicament stored in the medicament reservoir. The acoustic signal is transmitted to an external device configured to process the acoustic signal and to extract injection device data.

Abstract: Implementations of the present disclosure are directed to an injection device (102) including a medicament reservoir (103) configured to store a medicament to be expelled by the injection device (102), an acoustic source (122a, 122b, 122c, 122d, 200, 300, 400) configured to generate an acoustic signal including information indicative of an amount of the medicament stored in the medicament reservoir (103), the acoustic signal being transmitted to an external device (104) configured to process the acoustic signal and to extract injection device data.

Abstract: Implementations of the present disclosure are directed to an injection device (102) including a medicament reservoir (103) configured to store a medicament to be expelled by the injection device (102), an acoustic source (122a, 122b, 122c, 122d, 200, 300, 400) configured to generate an acoustic signal including information indicative of an amount of the medicament stored in the medicament reservoir (103), the acoustic signal being transmitted to an external device (104) configured to process the acoustic signal and to extract injection device data.

Abstract: Implementations of the present disclosure are directed to an injection device (102) including a medicament reservoir (103) configured to store a medicament to be expelled by the injection device (102), an acoustic source (122a , 122b, 122c, 122d, 200, 300, 400) configured to generate an acoustic signal including information indicative of an amount of the medicament stored in the medicament reservoir (103), the acoustic signal being transmitted to an external device (104) configured to process the acoustic signal and to extract injection device data.

Abstract: The present invention relates a tool head for a personal care appliance, including a plurality of tool rotors rotatably supported about rotor axes and a drive train for rotatably driving said tooling rotors from a motor, wherein such drive train includes: an input crank element having connection means for connecting to a drive shaft, a transmitter element configured to be driven by said input crank element, and output crank elements configured to be driven by said transmitter element to rotate about said rotor axis.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longitudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longditudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.