Patents by Inventor August J. Miller, Jr.

August J. Miller, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal via heat spreader package and method
    Patent number: 7960827
    Abstract: A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: June 14, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: August J. Miller, Jr., Jeffrey A. Miks, Christopher M. Scanlan, Mahmoud Dreiza