Abstract: A sputtering apparatus of the present invention includes a chamber for containing a plasma. A first and a second target are positioned in the chamber proximate to a substrate. The first and the second targets include at least one type of target material. A power supply is coupled to the first and the second targets. The power supply supplies power to the first and the second targets such that when the first target sputters target material, the second target becomes anodic and when the second target sputters target material, the first target becomes anodic. The sputtering apparatus also includes a reactive source that supplies reactive species proximate to the substrate. The reactive species are supplied in synchronization with the power supplied to the first and the second targets. The reactive species combines with the sputtered target material to generate a sputtered film on the substrate.

Abstract: In accordance with one embodiment of the present invention, an electrochemical conversion assembly comprises a plurality of electrochemical conversion cells and a plurality of electrically conductive bipolar plates. The electrochemical conversion cells are configured to communicate with first and second reactant supplies. Adjacent ones of the electrochemical conversion cells are separated by respective ones of the plurality of bipolar plates. The bipolar plates comprise an alloy comprising Fe and Cr. Respective surface portions of the bipolar plates are provided with electrically conductive, corrosion resistant layers that are placed in contact with portions of the electrochemical conversion cells. The corrosion resistant electrically conductive layers may comprise graphitic layers characterized predominantly by sp2 hybridized carbon-carbon bonding, molybdenum doped indium oxide layers, an electrically conductive Cr+N layer, or an electrically conductive MoSi2 layer.

Abstract: Nitrided bipolar plates and a scheme for their fabrication are provided. The present invention also contemplates device incorporating bipolar plates according to the present invention. For example, in accordance with one embodiment of the present invention, an electrochemical conversion assembly is provided. The electrochemical conversion cells of the assembly are separated by respective bipolar plates comprising an alloy of Fe and Cr. A surface portion of the bipolar plates comprises a single phase nitrided structure. According to another embodiment of the present invention, a plasma nitriding process is utilized to create a single phase nitrided structure along a surface portion of respective ones of said bipolar plates.