Patents by Inventor Augusto P. Panella

Augusto P. Panella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140141643
    Abstract: A patch panel adapter assembly is provided for use with infrastructure management systems that utilize a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. Individual “smart” patch panels, ones with increased functionality are provided and have a series of stub cables connected to them. These may be mounted, either in a group, or individually using standoffs, in opposition to ordinary patch panels. The stub cables are inserted into the ordinary patch panel jacks to provide a smart panel that may be used to control the network. Use of the adapter assemblies reduces the time and labor required to retrofit or upgrade an existing network.
    Type: Application
    Filed: March 26, 2012
    Publication date: May 22, 2014
    Applicant: MOLEX INCORPORATED
    Inventors: Augusto P. Panella, Dennis W.J. Curtis, Scott Adams, Elliot A. Baines
  • Patent number: 8562358
    Abstract: A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: October 22, 2013
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, Elliot A. Baines, Jeng-De Lin
  • Patent number: 8376787
    Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: February 19, 2013
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, Elliot A. Baines, Jeng-De Lin
  • Publication number: 20120226807
    Abstract: A method of identifying a new end-user device connected within a network includes monitoring a plurality of remote outlets and detecting a new end-user device upon connection thereof to the network at a first of the remote outlets and determining information about the new end-user device by electronically communicating with some but not all of the remote outlets. A system for performing such a method with a network having a plurality of end-user devices connected thereto is also disclosed.
    Type: Application
    Filed: October 5, 2010
    Publication date: September 6, 2012
    Applicant: MOLEX INCORPORATED
    Inventors: Augusto P. Panella, Elliot A. Baines, Jeng-De Lin
  • Patent number: 8251707
    Abstract: A structure for use with data network management systems uses a plurality of cables interconnecting patch panels, network devices and end-user devices and further utilizes integrated circuits to monitor the status of these end-user devices. The structure includes respective primary (36) and secondary (45) circuit boards. A plurality of connective jacks (31) are mounted on the primary circuit board and these jacks are interconnected to switches and other patch panels within the network. Wires from the jacks extend to and connect with end-user devices and a secondary circuit board is spaced apart from the primary circuit board so as to define a hollow nest (42) within the patch panel assembly that houses and protects integrated circuits (45, 52) and the like.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: August 28, 2012
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, Elliot A. Baines, Jeng-De Lin
  • Publication number: 20110256742
    Abstract: A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).
    Type: Application
    Filed: October 7, 2009
    Publication date: October 20, 2011
    Applicant: Molex Incorporated
    Inventors: Augusto P. Panella, Elliot A. Baines, Jeng-De Lin
  • Publication number: 20110256738
    Abstract: A structure for use with data network management systems uses a plurality of cables interconnecting patch panels, network devices and end-user devices and further utilizes integrated circuits to monitor the status of these end-user devices. The structure includes respective primary (36) and secondary (45) circuit boards. A plurality of connective jacks (31) are mounted on the primary circuit board and these jacks are interconnected to switches and other patch panels within the network. Wires from the jacks extend to and connect with end-user devices and a secondary circuit board is spaced apart from the primary circuit board so as to define a hollow nest (42) within the patch panel assembly that houses and protects integrated circuits (45, 52) and the like.
    Type: Application
    Filed: October 7, 2009
    Publication date: October 20, 2011
    Applicant: Molex Incorporated
    Inventors: Augusto P. Panella, Elliot a. Baines, Jeng-De Lin
  • Publication number: 20110195598
    Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.
    Type: Application
    Filed: October 7, 2009
    Publication date: August 11, 2011
    Inventors: Augusto P. Panella, Elliot C. Baines, Jeng-De Lin
  • Patent number: 7568960
    Abstract: The present disclosure is directed to connectors and methods for passing signals through capacitive coupling and electron tunneling. The connectors according to the present disclosure can include contacts that have a dielectric film or coating applied at least at a contact interface area where the contacts engage with the contacts of a complementary mating connector. The contacts of the either or both of the connector and complementary connector can be coated with a dielectric film. The dielectric film can be selected from metal oxides and can be applied using known methods such as vapor deposition methods, oxidative methods, plating methods and adhesive coating methods. Performance parameters such as capacitance and resistance can be selected by selecting the material for the film and the thickness of the dielectric film and provides a contrast between the requirements for high frequency signal transfer using capacitive coupling and electron tunneling versus traditional metallic contact.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: August 4, 2009
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, Robert D. Malucci
  • Publication number: 20080299841
    Abstract: The present disclosure is directed to connectors and methods for passing signals through capacitive coupling and electron tunneling. The connectors according to the present disclosure can include contacts that have a dielectric film or coating applied at least at a contact interface area where the contacts engage with the contacts of a complementary mating connector. The contacts of the either or both of the connector and complementary connector can be coated with a dielectric film. The dielectric film can be selected from metal oxides and can be applied using known methods such as vapor deposition methods, oxidative methods, plating methods and adhesive coating methods. Performance parameters such as capacitance and resistance can be selected by selecting the material for the film and the thickness of the dielectric film and provides a contrast between the requirements for high frequency signal transfer using capacitive coupling and electron tunneling versus traditional metallic contact.
    Type: Application
    Filed: April 18, 2008
    Publication date: December 4, 2008
    Applicant: Molex Incorporated
    Inventors: Augusto P. Panella, Robert D. Malucci
  • Patent number: 7298628
    Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: November 20, 2007
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, John E. Lopata, James L. McGrath, Arindum Dutta
  • Patent number: 7095619
    Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: August 22, 2006
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, John E. Lopata, James L. McGrath, Arindum Dutta
  • Patent number: 6936917
    Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: August 30, 2005
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, Augusto P. Panella, Arindum Dutta, James L. McGrath
  • Patent number: 6888235
    Abstract: Systems for power delivery to an integrated circuit include a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system delivers power to the IC along various surfaces thereof by way of a plurality of discrete capacitors that are supported by a socket-style connector. The socket-style connector has an insulative body portion that is mounted to a circuit board and has a recess defined thereon that receives the IC therein. A plurality of capacitors are integrated with the body portion and, each of the capacitors supplies a desired amount of power to the IC. The capacitors are charged by way of leads on the circuit board that bring power to current to the capacitors and then are discharged as the IC draws power from the socket such that the capacitors form a power reservoir integrated with the socket, thereby eliminating the need for mounting such capacitors on the circuit board near the IC and freeing up space on the circuit board.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: May 3, 2005
    Assignee: Molex Incorporated
    Inventors: John Lopata, Augusto P. Panella, Arindum Dutta, Jeoffrey Urbanowski
  • Patent number: 6885563
    Abstract: Systems for power delivery, signal transfer, package design, thermal management, and electromagnetic interference (“EMI”) control are provided to support an integrated circuit (“IC”). The power delivery system includes a power supply, a voltage regulator module and a decoupling capacitance in the form of discrete and/or integral capacitors. The voltage regulator module and decoupling capacitance are located in a connector that may be formed as a cover, socket or a frame for the IC. The power delivery system delivers power to the IC along top, bottom or sides of the IC. The signal transfer system couples signals from the IC to one or more circuits on a circuit board. The package design system for the IC permits signals and/or power to be coupled to selected sides of the IC at connections outside, flush with, recessed or inside the IC package.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: April 26, 2005
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, James L. McGrath
  • Patent number: 6853559
    Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: February 8, 2005
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, Arindum Dutta, James L. McGrath
  • Patent number: 6837719
    Abstract: A substrate carries a voltage regulator module and a connector. By co-locating a voltage regulator to a processor or other circuit requiring a regulated power supply, distributed inductance associated with conventional circuit traces is reduced, thereby lessening demands on a voltage regulator and improving regulated voltage. A connector on the substrate can include internal filter capacitors to stabilize the output voltage from a voltage regulator. When the substrate is mounted to a circuit board, addition capacitors can be provided above and/or below the circuit board to which the substrate can be connected attached.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: January 4, 2005
    Assignee: Molex Incorporated
    Inventor: Augusto P. Panella
  • Patent number: 6767252
    Abstract: A differential signal connector that is used for edge card application has a plurality of differential signal terminals and associated ground terminals arranged in “triplets”, i.e., distinct sets of three conductive terminals, each such triplet including a pair of differential signal terminals and one associated ground terminal. The ground terminal is flanked by the two differential signal terminals and each triplet is spaced apart from an adjacent triplet by a spacing which is greater than any single spacing between adjacent terminals within a triplet. Circuit boards to which such a connector is mounted are also disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: July 27, 2004
    Assignee: Molex Incorporated
    Inventors: James L. McGrath, James P. Capadona, Daniel B. McGowan, Augusto P. Panella
  • Publication number: 20030202330
    Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
    Type: Application
    Filed: September 25, 2002
    Publication date: October 30, 2003
    Inventors: John D. Lopata, Augusto P. Panella, Arindum Dutta, James L. McGrath
  • Patent number: RE38736
    Abstract: A card edge connector for mounting on a circuit board and removeably receiving a circuit card includes an elongated housing defining a card receiving slot. Numerous terminal receiving cavities intersect and extend to both sides of the slot. Alternate cavities include stamped references (ground or power) terminals and signal terminals, all having downwardly extending board contacts and upwardly extending spring arms. There are numerous similar sets of face to face contacts, each including a reference contact parallel to and substantially overlying an opposed pair of signal contacts. The upwardly extending reference terminal spring arms include oversize pad portions for reducing crosstalk by increasing coupling between the reference and signal terminals. The circuit paths to the circuit board are in an array symmetrical about the centerline of the circuit card, with parallel inner lines of circuits containing only reference contacts and outer lines of circuits containing only signal contacts.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: May 17, 2005
    Assignee: Molex Incorporated
    Inventors: Alan S. Walse, Harold Keith Lang, Augusto P. Panella, Irvin R. Triner, Shyh-Lin Tung