Abstract: A solution is provided that can be used in a communication node. A case is provided that supports a first circuit board that is connected to a second circuit board via a connection. The first circuit board supports an integrated circuit module and the second circuit board supports a PHY module. A transformer box is mounted on the first circuit board and supports terminals for engagement with a mating connector. A third circuit board can be provided that is parallel to the second circuit board and is mounted on the transformer box so that termination of signals provided to the terminals can take place on a different circuit board than the second circuit board. The third circuit board can also provide power over Ethernet (POE) circuitry.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56. Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine.

Abstract: An improved patch panel assembly includes a frame and faceplate that mate with a housing, and the housing defines a plurality of individual communication ports. The housing is mounted to the patch panel frame and includes jack openings that accommodate data jacks and circuit board openings that accommodate mating blades of circuit boards. The two sets of openings are separated on the housing by an intervening spacing and interposer terminal sets are provided to electrically interconnect the jacks with circuits on the circuit boards. The patch panel housings may be formed in discrete groupings so that, if desired, the patch panels may have ports that are grouped together by bandwidth, storage capability and the like. Inasmuch as the housings are mounted to the patch panel frames, the jacks and the circuit boards can be easily and individually replaced, repaired or upgraded with similar components without requiring disassembly of the patch panel.

Abstract: An improved patch panel assembly includes a frame and faceplate that mate with a housing, and the housing defines a plurality of individual communication ports. The housing is mounted to the patch panel frame and includes jack openings that accommodate data jacks and circuit board openings that accommodate mating blades of circuit boards. The two sets of openings are separated on the housing by an intervening spacing and interposer terminal sets are provided to electrically interconnect the jacks with circuits on the circuit boards. The patch panel housings may be formed in discrete groupings so that, if desired, the patch panels may have ports that are grouped together by bandwidth, storage capability and the like. Inasmuch as the housings are mounted to the patch panel frames, the jacks and the circuit boards can be easily and individually replaced, repaired or upgraded with similar components without requiring disassembly of the patch panel.

Abstract: A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.

Abstract: A solution is provided that can be used in a communication node. A case is provided that supports a first circuit board that is connected to a second circuit board via a connection. The first circuit board supports an integrated circuit module and the second circuit board supports a PHY module. A transformer box is mounted on the first circuit board and supports terminals for engagement with a mating connector. A third circuit board can be provided that is parallel to the second circuit board and is mounted on the transformer box so that termination of signals provided to the terminals can take place on a different circuit board than the second circuit board. The third circuit board can also provide power over Ethernet (POE) circuitry.

Abstract: An improved patch panel assembly includes a frame and faceplate that mate with a housing, and the housing defines a plurality of individual communication ports. The housing is mounted to the patch panel frame and includes jack openings that accommodate data jacks and circuit board openings that accommodate mating blades of circuit boards. The two sets of openings are separated on the housing by an intervening spacing and interposer terminal sets are provided to electrically interconnect the jacks with circuits on the circuit boards. The patch panel housings may be formed in discrete groupings so that, if desired, the patch panels may have ports that are grouped together by bandwidth, storage capability and the like. Inasmuch as the housings are mounted to the patch panel frames, the jacks and the circuit boards can be easily and individually replaced, repaired or upgraded with similar components without requiring disassembly of the patch panel.

Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

Abstract: A power contact is provided by utilizing a box-type structure formed form the mating together of two interengaging U-shaped channels. The channels have a web and two flanges extending from the web, in a spaced-apart fashion, to define a hollow, intervening space that extends lengthwise through the channel. A contact arm may be formed in the webs of the two channels, and the contact arms extend inwardly from their respective webs into the hollow, intervening space. The contact arms engage each other when the channels are engaged together in a fashion so that the webs are on opposing surfaces of the contact.

Abstract: A method and structure of an electrical connector is provided for tuning the impedance of the terminals in the connector. The connector includes a dielectric housing having a plurality of terminal-receiving passages. A plurality of terminals are shaped from sheet metal material, with each terminal having a contact portion at one end and a terminating portion at an opposite end. The contact portion has a contact area which engages a mating terminal of a complementary mating connecting device. The contact portion, except for the contact thereof, or the tail portion, is selectively trimmed to a given size to vary the plate area of the contact portion or the tail portion to adjust the impedance of the terminal. This may be done by removing sections of the contact portion from the contact edges or by forming holes in the contact portions. Alternatively, to adjust impedance, a drive shoulder of the terminal may be located at a position to lengthen or shorten the contact portion or tail portion.

Abstract: A method and structure of an electrical connector is provided for tuning the impedance of the terminals in the connector. The connector includes a dielectric housing having a plurality of terminal-receiving passages. A plurality of terminals are shaped from sheet metal material, with each terminal having a contact portion at one end and a terminating portion at an opposite end. The contact portion has a contact area which engages a mating terminal of a complementary mating connecting device. The contact portion, except for the contact thereof, or the tail portion, is selectively trimmed to a given size to vary the plate area of the contact portion or the tail portion to adjust the impedance of the terminal.