Patents by Inventor Aurélien Carin

Aurélien Carin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electro-conducting tile or floorboard floor covering
    Patent number: 10129968
    Abstract: A component, such as a title or a floorboard, has electro-conductive properties for producing a floor covering, or a similar system, in particular for a medium sensitive to static electricity. The component includes a stack of layers integral with one another and including successively: a wearing layer of plastic consisting of granules of conductive material spread out through the thickness of said wearing layer, a first textile reinforcing armature, a middle layer of plastic comprising granules of conductive material spread out through the thickness of said middle layer, a second textile reinforcing armature, and an under layer of plastic material consisting of granules of conductive material spread out through the thickness of said under layer.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: November 13, 2018
    Assignee: GERFLOR
    Inventors: Olivier Ceysson, Aurélien Carin
  • ELECTRO-CONDUCTING TILE OR FLOORBOARD FLOOR COVERING
    Publication number: 20160262249
    Abstract: A component, such as a title or a floorboard, has electro-conductive properties for producing a floor covering, or a similar system, in particular for a medium sensitive to static electricity. The component includes a stack of layers integral with one another and including successively: a wearing layer of plastic consisting of granules of conductive material spread out through the thickness of said wearing layer, a first textile reinforcing armature, a middle layer of plastic comprising granules of conductive material spread out through the thickness of said middle layer, a second textile reinforcing armature, and an under layer of plastic material consisting of granules of conductive material spread out through the thickness of said under layer.
    Type: Application
    Filed: February 25, 2016
    Publication date: September 8, 2016
    Inventors: Olivier Ceysson, Aurélien Carin