Abstract: Production of a device for connecting a nano-object to an external electrical system (SEE) including: a first chip provided with conducting areas (8a, 8b) and a first nano-object (50) connected to the conducting areas, the first chip being assembled on a support (70) such that the first nano-object is arranged facing an upper face of the support, the device being further provided with first connection elements (80a, 80b) capable of being connected to the external electrical system and arranged on and in contact with the first conducting areas (8a, 8b), the first connection elements being formed on the side of the upper face of the support (70) and being accessible from the side of the upper face of the support.

Abstract: Manufacturing of a device to connect at least one nano-object to an external electrical system, comprising a support provided with a semiconducting layer in which the first doped zones are formed at a spacing from each other, an external electrical system being connectable to the first doped zones, each first doped zone (8a, 8b) being in contact with a second doped zone on which a portion of the nano-object is located, the second doped zones being separated from each other and with a thickness less than the thickness of the first doped zones.

Abstract: Manufacturing of a device to connect at least one nano-object to an external electrical system, comprising a support provided with a semiconducting layer (4) in which the first doped zones (8a, 8b) are formed at a spacing from each other, an external electrical system (SEE) being connectable to the first doped zones, each first doped zone (8a, 8b) being in contact with a second doped zone (12a, 12b) on which a portion of the nano-object is located, the second doped zones (12a, 12b) being separated from each other and with a thickness (e2) less than the thickness (e1) of the first doped zones (FIG. 1).

Abstract: Production of a device for connecting a nano-object to an external electrical system (SEE) including: a first chip provided with conducting areas (8a, 8b) and a first nano-object (50) connected to the conducting areas, the first chip being assembled on a support (70) such that the first nano-object is arranged facing an upper face of the support, the device being further provided with first connection elements (80a, 80b) capable of being connected to the external electrical system and arranged on and in contact with the first conducting areas (8a, 8b), the first connection elements being formed on the side of the upper face of the support (70) and being accessible from the side of the upper face of the support.

Abstract: Device for connecting nano-objects to external electrical systems, and method for producing the device. According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer equipped with upper contact pads to be connected to a nano-object; a lower layer, equipped with lower contact pads to be connected to an external electrical system; above the lower layer, a bonding layer including electrical through-vias in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers equipped with conductive lines and electrical vias, for connecting the upper pads to the lower pads.

Abstract: Device for connecting nano-objects to external electrical systems, and method for producing the device. According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer (16) equipped with upper contact pads (8) to be connected to a nano-object (2); a lower layer (18), equipped with lower contact pads (12) to be connected to an external electrical system (4); above the lower layer, a bonding layer (20) including electrical through-vias (22) in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers (22, 24) equipped with conductive lines (25) and electrical vias (26), for connecting the upper pads to the lower pads.