Abstract: An electronic system includes first, second, third, and fourth integrated circuit dies. The third integrated circuit die has a first voltage regulator circuit. A supply voltage output of the first voltage regulator circuit is coupled to provide a first supply voltage to a supply voltage input of the first integrated circuit die. The first voltage regulator circuit generates a first power ready signal that indicates when the first supply voltage has reached a first threshold voltage. The fourth integrated circuit die has a second voltage regulator circuit that generates a second supply voltage in response to the first power ready signal. A supply voltage output of the second voltage regulator circuit is coupled to provide the second supply voltage to a supply voltage input of the second integrated circuit die.

Abstract: A method is provided for thermally monitoring an integrated circuit during operation of the integrated circuit. The method includes receiving a measurement of a temperature in a circuit design for the integrated circuit from a temperature sensor, and determining a hottest temperature in the circuit design based on the measurement of the temperature. A non-transitory computer readable storage medium includes computer readable instructions stored thereon for causing a computing system to receive a measurement of a first temperature in a circuit design for an integrated circuit from a temperature sensor, and determine a second temperature of a cold spot in an active region of the circuit design by adjusting the measurement of the first temperature generated by the temperature sensor by an offset.

Abstract: An electronic system includes first, second, third, and fourth integrated circuit dies. The third integrated circuit die has a first voltage regulator circuit. A supply voltage output of the first voltage regulator circuit is coupled to provide a first supply voltage to a supply voltage input of the first integrated circuit die. The first voltage regulator circuit generates a first power ready signal that indicates when the first supply voltage has reached a first threshold voltage. The fourth integrated circuit die has a second voltage regulator circuit that generates a second supply voltage in response to the first power ready signal. A supply voltage output of the second voltage regulator circuit is coupled to provide the second supply voltage to a supply voltage input of the second integrated circuit die.

Abstract: An embodiment of a semiconductor package apparatus may include technology to independently bring a first memory power node one of online and offline based on a runtime memory control signal, and independently bring a second memory power node one of online and offline based on the runtime memory control signal. Other embodiments are disclosed and claimed.

Abstract: A device and method for dynamically optimizing a power converter is disclosed. The dynamically optimized power converter unit includes a processor that maximizes efficiency of a power converter supplying energy to a load.