Abstract: A device has a piezoelectric or ferroelectric substrate on which ice is deposited. Electrodes are connected to the substrate. A vector network analyzer is connected to the electrodes and configured to determine the resonant frequency of the substrate. An excitation module including a function generator communicates with the vector network analyzer and is connected to an amplifier. The amplifier is connected to the electrodes. The excitation module uses an automatic switch to apply to the electrodes an AC electrical signal having a frequency coinciding with the resonant frequency measured in the vector network analyzer and which changes gradually as the ice melts.

Abstract: A method for bonding two confronting electronic devices together wherein the two electronic devices are initially temporarily coupled together using a room temperature process with a plurality of knife-edge microstructures on at least a first one of the electronic devices engaging portions of the a second one of the electronic devices. The room temperature process involves applying a relatively low compressive force or pressure between the two electronic devices compared to the forces or pressures used in convention flip-chip bonding. The first one of the electronic devices and the second one of the electronic devices also have traditional contact pads that are spaced from each other by a standoff distance when the devices are initially coupled together using the room temperature process. This allows for inspection of the two electronic devices while they are initially temporarily coupled together.

Abstract: A method and apparatus for laterally urging two semiconductor chips, dies or wafers into an improved state of registration with each other, the method and apparatus employing microstructures comprising: a first microstructure disposed on a first major surface of a first one of said two semiconductor chips, dies or wafers, wherein the first microstructure includes a sidewall which is tapered thereby disposing it at an acute angle compared to a perpendicular of said first major surface, and a second microstructure disposed on a first surface of a second one of said two semiconductor chips, dies or wafers, wherein the shape of the second microstructure is complementary to, and mates with or contacts, in use, the first microstructure, the second microstructure including a surface which contacts said sidewall when the first and second microstructures are mated or being mated, the sidewall of the first microstructure and the surface of the second microstructure imparting a lateral force for urging the two semicondu

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Abstract: A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Abstract: The invention provides a method for extracting oil from a starting plant material. The method includes passing a solvent through the plant material to obtain a first extract; allowing the first extract to reside in a pre-set temperature bath for a predetermined time to precipitate the impurities; filtering the precipitated impurities to obtain a second extract; and separating the solvent from the second extract to obtain a pure oil. An integrated oil extraction apparatus is provided. The apparatus includes an extraction chamber having an upper end and a lower end, a collection chamber and a de-wax chamber sandwiched between the extraction chamber and the collection chamber.