Patents by Inventor Ava Crowley

Ava Crowley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260021635
    Abstract: In an embodiment, the present disclosure pertains to a method of direct ink writing (DIW). In general, the method includes extruding a resin from a print head, applying radio frequency (RF) heating to the resin, and inducing partial curing of the extruded resin layer-by-layer to thereby form a self-supporting structure. In an additional embodiment, the present disclosure pertains to a system for DIW. In some embodiments, the system includes a print head operable to extrude a resin from a nozzle and an RF applicator.
    Type: Application
    Filed: July 21, 2025
    Publication date: January 22, 2026
    Applicant: The Texas A&M University System
    Inventors: Anubhav Sarmah, Ava Crowley, Suchi Desai, Gabriel Zolton, Micah J. Green
  • Patent number: 12365137
    Abstract: In an embodiment, the present disclosure pertains to a method of direct ink writing (DIW). In general, the method includes extruding a resin from a print head, applying radio frequency (RF) heating to the resin, and inducing partial curing of the extruded resin layer-by-layer to thereby form a self-supporting structure. In an additional embodiment, the present disclosure pertains to a system for DIW. In some embodiments, the system includes a print head operable to extrude a resin from a nozzle and an RF applicator.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: July 22, 2025
    Assignee: The Texas A&M University System
    Inventors: Anubhav Sarmah, Ava Crowley, Suchi Desai, Gabriel Zolton, Micah J. Green
  • Publication number: 20230173755
    Abstract: In an embodiment, the present disclosure pertains to a method of direct ink writing (DIW). In general, the method includes extruding a resin from a print head, applying radio frequency (RF) heating to the resin, and inducing partial curing of the extruded resin layer-by-layer to thereby form a self-supporting structure. In an additional embodiment, the present disclosure pertains to a system for DIW. In some embodiments, the system includes a print head operable to extrude a resin from a nozzle and an RF applicator.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 8, 2023
    Inventors: Anubhav Sarmah, Ava Crowley, Suchi Desai, Gabriel Zolton, Micah J. Green