Patents by Inventor Avi Pollak

Avi Pollak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7479794
    Abstract: A method and apparatus for constructing a probe card assembly is provided. A probe pin is inserted into an aperture of an inverted socket enclosure to cause a probe pin shoulder of the probe pin to make contact with an aperture shoulder of the aperture. An upper end of the probe pin protrudes from the aperture after the probe pin shoulder makes contact with the aperture shoulder. A compressible member is inserted into the aperture to position an upper end of the compressible member to make contact with a lower portion of the probe pin. A substrate is aligned over the inverted socket enclosure so that the lower end of the compressible member is in contact with a substrate contact located on the substrate. The substrate is affixed in a non-permanent manner to the inverted socket enclosure.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: January 20, 2009
    Assignee: SV Probe Pte Ltd
    Inventors: Dov Chartarifsky, Avi Pollak, Dan Mironescu
  • Publication number: 20080204061
    Abstract: A method and apparatus for constructing a probe card assembly is provided. A probe pin is inserted into an aperture of an inverted socket enclosure to cause a probe pin shoulder of the probe pin to make contact with an aperture shoulder of the aperture. An upper end of the probe pin protrudes from the aperture after the probe pin shoulder makes contact with the aperture shoulder. A compressible member is inserted into the aperture to position an upper end of the compressible member to make contact with a lower portion of the probe pin. A substrate is aligned over the inverted socket enclosure so that the lower end of the compressible member is in contact with a substrate contact located on the substrate. The substrate is affixed in a non-permanent manner to the inverted socket enclosure.
    Type: Application
    Filed: February 28, 2007
    Publication date: August 28, 2008
    Inventors: Dov Chartarifsky, Avi Pollak, Dan Mironescu