Abstract: A SIP (system in package) with a chip and a memory mode, capable of performing integration test on the memory module even if the memory module does not include any scan chain is provided. The chip has a built-in self-test (BIST) circuit, which generates test pattern signals to test the memory module in response to a mode signal. Under a test mode, after the memory module receives the test pattern signals, the memory module outputs responsive readout signals to the BIST circuit and the BIST circuit determines and outputs a test result and a test record in response to the readout signals. If the test fails, conditions of the faulty memory module are recognized from the test record.

Abstract: A SIP (system in package) with a chip and a memory mode, capable of performing integration test on the memory module even if the memory module does not include any scan chain is provided. The chip has a built-in self-test (BIST) circuit, which generates test pattern signals to test the memory module in response to a mode signal. Under a test mode, after the memory module receives the test pattern signals, the memory module outputs responsive readout signals to the BIST circuit and the BIST circuit determines and outputs a test result and a test record in response to the readout signals. If the test fails, conditions of the faulty memory module are recognized from the test record.