Abstract: Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.