Patents by Inventor Aviram Gutman

Aviram Gutman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8051212
    Abstract: A network interface adapter includes an outgoing packet generator, adapted to generate an outgoing request packet for delivery to a remote responder responsive to a request submitted by a host processor and a network output port, coupled to transmit the outgoing request packet over a network to the remote responder. A network input port receives an incoming response packet from the remote responder, in response to the outgoing request packet sent thereto, as well as an incoming request packet sent by a remote requester. An incoming packet processor receives and processes both the incoming response packet and the incoming request packet, and causes the outgoing packet generator, responsive to the incoming request packet, to generate, in addition to the outgoing request packet, an outgoing response packet for transmission to the remote requester.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: November 1, 2011
    Assignee: Mellanox Technologies Ltd.
    Inventors: Michael Kagan, Diego Crupnicoff, Margarita Shnitman, Ariel Shachar, Ram Izhaki, Gilad Shainer, Aviram Gutman, Benny Koren, Dafna Levenvirth, Gil Bloch, Yael Shenhav
  • Publication number: 20060129699
    Abstract: A network interface adapter includes an outgoing packet generator, adapted to generate an outgoing request packet for delivery to a remote responder responsive to a request submitted by a host processor and a network output port, coupled to transmit the outgoing request packet over a network to the remote responder. A network input port receives an incoming response packet from the remote responder, in response to the outgoing request packet sent thereto, as well as an incoming request packet sent by a remote requester. An incoming packet processor receives and processes both the incoming response packet and the incoming request packet, and causes the outgoing packet generator, responsive to the incoming request packet, to generate, in addition to the outgoing request packet, an outgoing response packet for transmission to the remote requester.
    Type: Application
    Filed: February 7, 2006
    Publication date: June 15, 2006
    Inventors: Michael Kagan, Diego Crupnicoff, Ariel Schachar, Ram Izhaki, Gilad Shainer, Aviram Gutman, Benny Koren, Dafna Levenvirth, Gil Bloch, Yael Shenhav
  • Publication number: 20020152327
    Abstract: A network interface adapter includes an outgoing packet generator, adapted to generate an outgoing request packet for delivery to a remote responder responsive to a request submitted by a host processor and a network output port, coupled to transmit the outgoing request packet over a network to the remote responder. A network input port receives an incoming response packet from the remote responder, in response to the outgoing request packet sent thereto, as well as an incoming request packet sent by a remote requester. An incoming packet processor receives and processes both the incoming response packet and the incoming request packet, and causes the outgoing packet generator, responsive to the incoming request packet, to generate, in addition to the outgoing request packet, an outgoing response packet for transmission to the remote requester.
    Type: Application
    Filed: December 4, 2001
    Publication date: October 17, 2002
    Inventors: Michael Kagan, Diego Crupnicoff, Margarita Shnitman, Ariel Shachar, Ram Izhaki, Gilad Shainer, Aviram Gutman, Benny Koren, Dafna Levenvirth, Gil Bloch, Yael Shenhav
  • Patent number: 6426550
    Abstract: A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces. A method of routing signal traces in an electronic device package includes the acts of disposing a plurality of signal traces in at least one substrate layer, and interleaving a plurality of ground traces with the signal traces.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: July 30, 2002
    Assignee: Intel Corporation
    Inventors: Zane A. Ball, Aviram Gutman, Lawrence T. Clark
  • Patent number: 6352914
    Abstract: A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces. A method of routing signal traces in an electronic device package includes the acts of disposing a plurality of signal traces in at least one substrate layer, and interleaving a plurality of ground traces with the signal traces.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: March 5, 2002
    Assignee: Intel Corporation
    Inventors: Zane A. Ball, Aviram Gutman, Lawrence T. Clark
  • Publication number: 20010010395
    Abstract: A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces.
    Type: Application
    Filed: March 14, 2001
    Publication date: August 2, 2001
    Inventors: Zane A. Ball, Aviram Gutman, Lawrence T. Clark
  • Publication number: 20010009782
    Abstract: A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces.
    Type: Application
    Filed: March 14, 2001
    Publication date: July 26, 2001
    Inventors: Zane A. Ball, Aviram Gutman, Lawrence T. Clark
  • Patent number: 6246112
    Abstract: A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces. A method of routing signal traces in an electronic device package includes the acts of disposing a plurality of signal traces in at least one substrate layer, and interleaving a plurality of ground traces with the signal traces.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: June 12, 2001
    Assignee: Intel Corporation
    Inventors: Zane A. Ball, Aviram Gutman, Lawrence T. Clark