Abstract: A novel low mass transducer for bonding machines comprises a transducer generator which mounts on or is coupled to a bonding tool of the type used for ball bonding, wedge bonding and TAB bonding. The preferred embodiment transducer comprises a magnetostrictive or piezoelectric element which mount on the outside surface of the bonding tools used in a bonding operation, thus eliminating convention transducers which also serve as a bonding tool holder. The present invention bonding tool serves as the base or mount for a transducer made in the form of a sleeve or tube which mounts on or couples to the bonding tool. The novel transducer/bonding tool or transducers also serve as a sensor which can monitor the quality of a bond while it is being made.

Abstract: A digital programmable ultrasonic generator for driving an ultrasonic transducer includes a computer for receiving and storing a plurality of selectable programs. The programs are indicative of different modes of operation. A profile generator is coupled to the computer to receive programs and to produce a digital reference voltage indicative of a voltage profile to be generated for the mode selected. A digital frequency controller is coupled to a direct digital synthesizer for producing a predetermined frequency in response to a programmed frequency command from the computer. A process controller receives the output of the direct digital synthesizer as a voltage signal having the desired frequency and modifies the voltage depending on the mode of operation and voltage desired before driving a power amplifier coupled to the transducer to be driven.

Abstract: There is provided an ultrasonic generator of the type having a power amplifier. The output of the power amplifier is connected across and through an ultrasonic transducer which holds a bonding tool to be engaged on a bonding target. A current sufficient to induce a resonant frequency is applied across the ultrasonic transducer in air and before touch down on the bonding target while continuously monitoring the current and voltage across the transducer. A touch down detector circuit is coupled to the current and voltage being monitored and initiates a touch down signal which is employed to control these Z-axis drive motor of an automatic wire bonder within several microseconds of the actual touch down time.