Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

Abstract: A teaching substrate is loaded into a load port of an equipment front-end module (EFEM) of a fabrication or inspection tool. The EFEM includes a substrate-handling robot. The teaching substrate includes a plurality of sensors and one or more wireless transceivers. The tool includes a plurality of stations. With the teaching substrate in the EFEM, the substrate-handling robot moves along an initial route and sensor data are wirelessly received from the teaching substrate. Based at least in part on the sensor data, a modified route distinct from the initial route is determined. The substrate-handling robot moves along the modified route, handling the teaching substrate. Based at least in part on the sensor data, positions of the plurality of stations are determined.

Abstract: Systems and methods for generating volumetric data are disclosed. Such systems and methods may include scanning a sample at a plurality of focal planes located along a depth direction of the sample. Such systems and methods may include generating, via a detector of a metrology sub-system, a plurality of images of a volumetric field of view of the sample at the plurality of focal planes. Such systems and methods may include aggregating the plurality of images to generate volumetric data of the volumetric field of view of the sample. The metrology sub-system may include a Linnik interferometer.

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller, where the controller includes one or more processors. The one or more processors may be configured receive a plurality of training images captured at one or more focal positions. The one or more processors may further generate a machine learning classifier based on the plurality of training images captured at one or more focal positions. The one or more processors may further receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features of a target specimen. The one or more processors may further determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier.

Abstract: A reticle inspection system and a method of handling a reticle in a reticle inspection system are provided. The reticle inspection system includes an active reticle carrier and an inspection tool. The reticle is disposed on the active reticle carrier, and the inspection tool is configured to determine an orientation of the reticle when the active reticle carrier is disposed on a reticle stage. The active reticle carrier is movable between a loading station and the reticle stage and is configured to rotate the reticle to reorient the reticle based on the orientation of the reticle while the active carrier is disposed on the reticle stage.

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

Abstract: A metrology system may include an imaging sub-system to image a metrology target buried in a sample, where the sample is formed from bonded first and second substrates with a metrology target at the interface. The metrology system may further include an illumination sub-system with an illumination field stop and an illumination pupil, where the illumination field stop includes an aperture to provide that a projected size of the field-stop aperture on a measurement plane corresponding to the metrology target matches a field of view of the detector at the measurement plane, and where the illumination pupil includes a central obscuration to provide oblique illumination of the metrology target with angles greater than a cutoff angle selected to prevent illumination from the illumination source from reflecting off of the bottom surface of the sample and through the field of view of the detector at the measurement plane.

Abstract: A sample mapping system includes a sample chuck including absolute reference marks, an imaging metrology tool to capture sets of alignment images at locations associated with sample marks on a sample on the sample chuck, and a controller. A particular set of alignment images at a particular location may include at least one alignment image associated with a particular sample mark and at least one alignment image associated with a particular portion of the absolute reference marks within a field of view of the imaging metrology tool visible through the sample. The controller may determine absolute coordinates of the sample marks based on the sets of alignment images. Determining the absolute coordinates of the particular sample mark may include determining the absolute coordinates of the particular sample mark based on a position of the particular sample mark relative to the particular portion of the absolute reference marks.

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

Abstract: A reticle inspection system and a method of handling a reticle in a reticle inspection system are provided. The reticle inspection system includes an active reticle carrier and an inspection tool. The reticle is disposed on the active reticle carrier, and the inspection tool is configured to determine an orientation of the reticle when the active reticle carrier is disposed on a reticle stage. The active reticle carrier is movable between a loading station and the reticle stage and is configured to rotate the reticle to reorient the reticle based on the orientation of the reticle while the active carrier is disposed on the reticle stage.

Abstract: A metrology system may include an imaging sub-system to image a metrology target buried in a sample, where the sample is formed from bonded first and second substrates with a metrology target at the interface. The metrology system may further include an illumination sub-system with an illumination field stop and an illumination pupil, where the illumination field stop includes an aperture to provide that a projected size of the field-stop aperture on a measurement plane corresponding to the metrology target matches a field of view of the detector at the measurement plane, and where the illumination pupil includes a central obscuration to provide oblique illumination of the metrology target with angles greater than a cutoff angle selected to prevent illumination from the illumination source from reflecting off of the bottom surface of the sample and through the field of view of the detector at the measurement plane.

Abstract: A teaching substrate is loaded into a load port of an equipment front-end module (EFEM) of a fabrication or inspection tool. The EFEM includes a substrate-handling robot. The teaching substrate includes a plurality of sensors and one or more wireless transceivers. The tool includes a plurality of stations. With the teaching substrate in the EFEM, the substrate-handling robot moves along an initial route and sensor data are wirelessly received from the teaching substrate. Based at least in part on the sensor data, a modified route distinct from the initial route is determined. The substrate-handling robot moves along the modified route, handling the teaching substrate. Based at least in part on the sensor data, positions of the plurality of stations are determined.

Abstract: A thickness measurement system may include an illumination source, a beam splitter to split illumination from the illumination source into two beams, a translation stage configured to translate a reference sample along a measurement direction, a first interferometer to generate a first interferogram between a first surface of a test sample and a first surface of the reference sample, and a second interferometer to generate a second interferogram between a second surface of the test sample and a second surface of the reference sample. A thickness measurement system may further include a controller to receive interference signals from the first and second interferometers as the translation stage scans the reference sample, and determine a thickness of the test sample based on the thickness of the reference sample and a distance travelled by the translation stage between peaks of envelopes of the interference signals.

Abstract: A thickness measurement system may include an illumination source, a beam splitter to split illumination from the illumination source into two beams, a translation stage configured to translate a reference sample along a measurement direction, a first interferometer to generate a first interferogram between a first surface of a test sample and a first surface of the reference sample, and a second interferometer to generate a second interferogram between a second surface of the test sample and a second surface of the reference sample. A thickness measurement system may further include a controller to receive interference signals from the first and second interferometers as the translation stage scans the reference sample, and determine a thickness of the test sample based on the thickness of the reference sample and a distance travelled by the translation stage between peaks of envelopes of the interference signals.

Abstract: A notch detection system receives images of a sample from the imaging detector, in which the sample includes a notched surface and an un-notched surface bounded by a sidewall and further includes at least one notch known notch specifications. The images are generated such that illumination unobstructed by the sample is received by the detector and the sample prevents incident illumination from reaching the detector. The system further determines whether each image includes a notch, identifies the notched surface, and directs a sample positioner to position the sample with the notched surface in a selected direction when a notch is identified in at least one image of the one or more images.

Abstract: The invention is a system and method that enable obtaining ultra-high resolution interference, phase and OCT images at high speed. The system uses neither mechanical moving elements nor any optical/electro optical modulating means for obtaining the OCT images. Two OCT operating modes are available: for ultra-high resolution the system allows either spatial coherence TD-FF-OCT or temporal coherence TD-FF-OCT imaging, whereas for high resolution and ultra-high speed the system allows FD-FF-OCT imaging with full range imaging. In the TD mode, the OCT enface images are obtained in real time. In the FD mode, the 2D complex signal is reconstructed in real time. In both cases the method has the advantage of very high speed imaging with great immunity to noise.

Abstract: The invention is an optical system for up-conversion of SWIR images into visible images. The optical system of the invention comprises a liquid crystal optically addressed spatial light modulator (LC-OASLM), which acts as an optical valve, and two optionally GRADIUM lenses to reduce the size and complexity of the optical setup. In embodiments of the invention, the photosensitive layer is replaced by a photodiode or array of photodiodes and the liquid crystal layer is replaced by an array (film) of organic light emitting diodes which emit light at the VIS by collecting SWIR light or by a fluorescence layer with sensitivity in the SWIR range.

Abstract: A notch detection system receives images of a sample from the imaging detector, in which the sample includes a notched surface and an un-notched surface bounded by a sidewall and further includes at least one notch known notch specifications. The images are generated such that illumination unobstructed by the sample is received by the detector and the sample prevents incident illumination from reaching the detector. The system further determines whether each image includes a notch, identifies the notched surface, and directs a sample positioner to position the sample with the notched surface in a selected direction when a notch is identified in at least one image of the one or more images.

Abstract: The invention is an optical system for up-conversion of SWIR images into visible images. The optical system of the invention comprises a liquid crystal optically addressed spatial light modulator (LC-OASLM), which acts as an optical valve, and two optionally GRADIUM lenses to reduce the size and complexity of the optical setup. In embodiments of the invention, the photosensitive layer is replaced by a photodiode or array of photodiodes and the liquid crystal layer is replaced by an array (film) of organic light emitting diodes which emit light at the VIS by collecting SWIR light or by a fluorescence layer with sensitivity in the SWIR range.

Abstract: A system microscopy system and method that enable obtaining high resolution 3D images in a single shot are presented. The system is an ultra-high speed, real time multi wavelength phase shift interference microscopy system that uses three synchronized color CCD cameras. Each CCD is equipped with a precision achromatic phase mask which in turn allows obtaining ?/2 phase shifted signals in three different wavelengths simultaneously.