Patents by Inventor Avraham Bauer

Avraham Bauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package
    Patent number: 9514957
    Abstract: A method that may include of at least partially surrounding with an insulating encapsulation lead frames, an integrated circuit attachment and wire bonding while preventing the insulating encapsulation from contacting at least one area of a base element; and at least partially surrounding an exterior of the insulating encapsulation with a conductive coating that contacts at least one area of the base element.
    Type: Grant
    Filed: February 8, 2015
    Date of Patent: December 6, 2016
    Assignee: DSP Group LTD.
    Inventors: Avraham Bauer, Avraham Cohen
  • INTEGRATED CIRCUIT PACKAGE
    Publication number: 20150235927
    Abstract: A method that may include of at least partially surrounding with an insulating encapsulation lead frames, an integrated circuit attachment and wire bonding while preventing the insulating encapsulation from contacting at least one area of a base element; and at least partially surrounding an exterior of the insulating encapsulation with a conductive coating that contacts at least one area of the base element.
    Type: Application
    Filed: February 8, 2015
    Publication date: August 20, 2015
    Inventors: Avraham Bauer, Avraham Cohen