Abstract: An apparatus includes a photonic integrated circuit, which includes at least one splitter configured to split at least one input beam into multiple input beamlets and multiple phase modulators configured to phase-shift at least some of the input beamlets. The apparatus also includes an array of optical amplifiers configured to amplify the phase-shifted input beamlets and generate amplified beamlets. The apparatus further incudes a beam combiner configured to combine the amplified beamlets and generate an output beam. In addition, the apparatus includes a controller configured to control the phase modulators in order to adjust phasing of the phase-shifted input beamlets.

Abstract: A system includes at least one component configured to generate thermal energy, a heat spreader configured to remove thermal energy from the at least one component, and at least one substrate configured to remove thermal energy from the heat spreader. The heat spreader includes a first portion and a second portion. The first portion of the heat spreader is coupled to the substrate, and the second portion of the heat spreader is coupled to the at least one component. The first portion of the heat spreader includes high aspect-ratio structures that are separated from one another. The high aspect-ratio structures cause the first portion of the heat spreader to be pliable and able to accommodate a mismatch in coefficients of thermal expansion between a material in the heat spreader and a material in the substrate.

Abstract: An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.

Abstract: An apparatus includes a photonic integrated circuit, which includes at least one splitter configured to split at least one input beam into multiple input beamlets and multiple phase modulators configured to phase-shift at least some of the input beamlets. The apparatus also includes an array of optical amplifiers configured to amplify the phase-shifted input beamlets and generate amplified beamlets. The apparatus further incudes a beam combiner configured to combine the amplified beamlets and generate an output beam. In addition, the apparatus includes a controller configured to control the phase modulators in order to adjust phasing of the phase-shifted input beamlets.

Abstract: A liquid biological sample test cartridge is disclosed. The cartridge can include a tray. The cartridge can also include a chemical reaction pad supported by the tray. The cartridge can further include a chemical reaction pad cover disposed over the chemical reaction pad and coupled to the tray. The chemical reaction pad cover can have a sample opening to facilitate depositing a liquid biological sample at a predetermined location on the chemical reaction pad. In addition, the cartridge can include an outer cover operable to at least partially form an enclosure about the chemical reaction pad.

Abstract: A heating device for testing a biological sample is disclosed. The heating device can include a heat source operable to generate heat. In addition, the heating device can include a controller in communication with the heat source and operable to control heat generation by the heat source to heat a biological sample at less than or equal to about 2 degrees C./s. Furthermore, a heating device for testing a biological sample is disclosed that can include a heat source operable to generate heat to heat a biological sample. The biological sample can be at least partially contained within a removable enclosure distinct from the heating device. Additionally, the heating device can include an enclosure interface associated with the heat source. The enclosure interface can be configured to interface with the enclosure such that heat is transferred from the heat source to the enclosure by conduction.

Abstract: A system includes at least one component configured to generate thermal energy, a heat spreader configured to remove thermal energy from the at least one component, and at least one substrate configured to remove thermal energy from the heat spreader. The heat spreader includes a first portion and a second portion. The first portion of the heat spreader is coupled to the substrate, and the second portion of the heat spreader is coupled to the at least one component. The first portion of the heat spreader includes high aspect-ratio structures that are separated from one another. The high aspect-ratio structures cause the first portion of the heat spreader to be pliable and able to accommodate a mismatch in coefficients of thermal expansion between a material in the heat spreader and a material in the substrate.

Abstract: An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.

Abstract: One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.

Abstract: One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.

Abstract: A heat exchanger for thermally coupling a first fluid and second fluid is disclosed. The heat exchanger comprises plates comprising cores of thermally conductive graphite foam. A plurality of conduits for conveying the first fluid is formed in each core. Each plate further comprises thermally conductive barriers that sandwich the core, wherein the barriers are substantially impervious to r the first fluid and second fluid. Plates are stacked in a frame such that the frame and plates collectively define a plurality of channels for conveying the second fluid. Heat is exchanged between the primary fluid and the secondary fluid through the graphite-foam cores and barriers. Heat exchangers in accordance with the present invention can be lighter, have improved ratio of heat transfer surface density to heat exchanger volume, be lower cost, and/or be smaller for a given heat transfer capability than prior-art heat exchangers.

Abstract: A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320, 321 962a, 962b, 970a, 970b or 950) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.

Abstract: A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to a localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320 or 321) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.

Abstract: A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320, 321 962a, 962b, 970a, 970b or 950) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.

Abstract: A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to a localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320 or 321) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330) , such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.

Abstract: A method for converting lower temperature dissipated heat to other useful energy and apparatus therefore. Heat energy is transferred to a fluid contained within a conduit, and natural convection of the fluid is utilized to transfer kinetic energy of the heat to another type of energy such as electrical energy.

Abstract: A method for converting low temperature dissipated heat to other useful energy and apparatus therefor. Heat energy is transferred to a shape memory alloy using natural conduction of the heat. The kinetic energy of the shape memory alloy resulting from cyclic temperature variations is transferred to another type of energy such as electrical energy.

Abstract: A method for enhancing natural convection and for converting lower temperature dissipated heat to other useful energy and apparatus therefor. Heat energy is transferred to a medium contained with a channel, and natural convection of the medium is utilized to transfer kinetic energy to another type of energy such as electrical energy.

Abstract: A method for enhancing natural convection and for converting lower temperature dissipated heat to other useful energy and apparatus therefor. Heat energy is transferred to a medium contained with a channel, and natural convection of the medium is utilized to transfer kinetic energy to another type of energy such as electrical energy.

Abstract: An apparatus and method for converting waste heat from a low temperature heat source, such as an electrical component, to work energy and for efficiently transferring unconverted or remaining waste heat away from the heat source. The apparatus includes a chamber having a first location adapted to receive heat from the heat source, and a second location adapted to dissipate heat transferred via an acoustic wave in the chamber. The acoustic wave may be produced by a first vibration member coupled to an interior surface of the chamber and disposed at an end of the chamber, where the first vibration member is adapted to vibrate at a resonant frequency of the chamber. Alternatively, a first and a second vibration member that are both adapted to vibrate at the resonant frequency of the chamber may be disposed equidistant from opposing ends of the chamber to produce a standing acoustic wave within the chamber.