Patents by Inventor Avrid J. Berg

Avrid J. Berg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILM ADHESIVE BONDING APPARATUS AND PROCESS
    Publication number: 20120276351
    Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
    Type: Application
    Filed: July 6, 2012
    Publication date: November 1, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Avrid J. Berg, Donald A. Anderson, Paul S. Gregg, Michael L. Leggett
  • Film adhesive bonding apparatus and process
    Patent number: 8241448
    Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: August 14, 2012
    Assignee: The Boeing Company
    Inventors: Avrid J. Berg, Donald A. Anderson, Paul S. Gregg, Michael L. Leggett