Patents by Inventor Awei SUI

Awei SUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chamber sealing mechanism and pressurization bubble-eliminating equipment
    Patent number: 10168558
    Abstract: A chamber sealing mechanism and a pressurization bubble-eliminating equipment are provided. The chamber sealing mechanism includes an annular groove and a sealing ring, wherein the sealing ring and the annular groove are connected to form a closed cavity; the annular groove is provided with a gas charging valve that communicates with the closed cavity and is configured to charge air into the closed cavity and discharge air from the closed cavity.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: January 1, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Bo Zhang, Jinjun Wang, Rui Hu, Ju Gao, Fanlin Ye, Awei Sui, Wenping Zhao
  • CHAMBER SEALING MECHANISM AND PRESSURIZATION BUBBLE-ELIMINATING EQUIPMENT
    Publication number: 20170192259
    Abstract: A chamber sealing mechanism and a pressurization bubble-eliminating equipment are provided. The chamber sealing mechanism includes an annular groove and a sealing ring, wherein the sealing ring and the annular groove are connected to form a closed cavity; the annular groove is provided with a gas charging valve that communicates with the closed cavity and is configured to charge air into the closed cavity and discharge air from the closed cavity.
    Type: Application
    Filed: September 9, 2016
    Publication date: July 6, 2017
    Inventors: Bo ZHANG, Jinjun WANG, Rui HU, Ju GAO, Fanlin YE, Awei SUI, Wenping ZHAO