Patents by Inventor Axel Kiesel

Axel Kiesel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
    Patent number: 8622783
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: January 7, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • Electrochemical planarization system comprising enhanced electrolyte flow
    Patent number: 8506770
    Abstract: A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: August 13, 2013
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Axel Kiesel, Johannes Groschopf
  • METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY CONTROLLABLY MOVING A SLURRY OUTLET
    Publication number: 20110237161
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Application
    Filed: June 10, 2011
    Publication date: September 29, 2011
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
    Patent number: 7980922
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: July 19, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • ELECTROCHEMICAL PLANARIZATION SYSTEM COMPRISING ENHANCED ELECTROLYTE FLOW
    Publication number: 20100163426
    Abstract: A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided.
    Type: Application
    Filed: December 23, 2009
    Publication date: July 1, 2010
    Inventors: Axel Kiesel, Johannes Groschopf
  • CMP SYSTEM HAVING AN EDDY CURRENT SENSOR OF REDUCED HEIGHT
    Publication number: 20080242195
    Abstract: By providing an eddy current sensor element in a polishing tool at a reduced height level in combination with a corresponding optical endpoint detection system, standard polishing pads may be used, thereby enhancing the lifetime of the polishing pad and increasing tool utilization.
    Type: Application
    Filed: November 15, 2007
    Publication date: October 2, 2008
    Inventors: Jens Heinrich, Axel Kiesel, Uwe Stoeckgen, Mike Schlicker
  • METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY CONTROLLABLY MOVING A SLURRY OUTLET
    Publication number: 20080132152
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Application
    Filed: June 6, 2007
    Publication date: June 5, 2008
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram