Patents by Inventor Axel Koniger

Axel Koniger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component including a housing and a substrate
    Patent number: 6930383
    Abstract: The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: August 16, 2005
    Assignee: Infineon Technologies AG
    Inventors: Hans-Jürgen Hacke, Holger Hübner, Axel Königer, Max-Gerhard Seitz, Rainer Tilgner
  • Electronic component including a housing and a substrate
    Publication number: 20030116840
    Abstract: The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.
    Type: Application
    Filed: December 16, 2002
    Publication date: June 26, 2003
    Inventors: Hans-Jurgen Hacke, Holger Hubner, Axel Koniger, Max-Gerhard Seitz, Rainer Tilgner