Abstract: A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.

Abstract: A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.

Abstract: A solar cell (1) is proposed, which is having at least at one side a semiconductor surface (2), on which edges (3) are formed having flank-like regions (4) running substantially parallel to the substrate normal and on which the electrical conductive contacts (5) are arranged. To be able to produce solar cells using simple technology with high cell efficiencies the electrical conductive material is deposited to the flank-like regions as well as to some none flank-like areas (6). The electrical conductive material is removed mask-free and selectively from the none flank-like areas resulting in electrical conducting contacts remaining on the flank-like regions only.