Patents by Inventor Axel Seikowsky

Axel Seikowsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230366489
    Abstract: The invention relates to a device for the pressure-tight feedthrough of a line comprising a deformable jacket through a feedthrough in a wall which separates a first pressure area from a second pressure area with a sleeve surrounding the line in the area of the feedthrough, which has at least two spaced annular constrictions, notches, grooves or the like created by forming, between which the material of the jacket is compressed by forming into an integral ring seal acting between the jacket and the sleeve, where the sleeve is being pressure-tightly connected or being connectable to the wall around the feedthrough, at least from one side. Furthermore, the invention relates to a method for the manufacture of a corresponding device.
    Type: Application
    Filed: July 16, 2021
    Publication date: November 16, 2023
    Inventors: Stefan Stelzl, Axel Seikowsky, Christian Ecke, Thomas Wisspeintner
  • Publication number: 20190003857
    Abstract: A non-contact working sensor, especially an inductive or capacitive sensor, preferably for measuring the distance or position of an object, with an inductive or capacitive sensor element, wherein measuring elements of the sensor element are embedded in a multilayered ceramic and together with the ceramic form the sensor element, is characterized in that the sensor element is constructed geometrically and/or electrically symmetrical in regard to its measuring elements and in that a mounting spaced apart from a holder is realized with the least possible contact surfaces on the sensor element. Furthermore, the invention relates to a sensor element, such as is used in the sensor according to the invention.
    Type: Application
    Filed: February 9, 2017
    Publication date: January 3, 2019
    Applicant: Micro-Epsilon Messtechnik GmbH & Co., KG
    Inventors: Josef HACKL, Axel SEIKOWSKY, Martin WASMEIER
  • Patent number: 8833160
    Abstract: The invention relates to a sensor, comprising a sensor element (1) that operates without contact, an electronic component (5), and a housing (2) having an electrical/electronic connection. The sensor element (1) is part of the housing (2) and is used to close and seal the housing (2) with respect to the measurement side (3).
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: September 16, 2014
    Assignee: Micro-Epsilon Messtechnik GmbH & Co. KG
    Inventors: Reinhold Hoenicka, Josef Nagl, Tobias Schopf, Heinrich Baumann, Axel Seikowsky
  • Publication number: 20130139589
    Abstract: The invention relates to a sensor, comprising a sensor element (1) that operates without contact, an electronic component (5), and a housing (2) having an electrical/electronic connection. The sensor element (1) is part of the housing (2) and is used to close and seal the housing (2) with respect to the measurement side (3).
    Type: Application
    Filed: December 15, 2010
    Publication date: June 6, 2013
    Applicant: MICRO-EPSILON MESSTECHNIK GMBH & CO. KG
    Inventors: Reinhold Hoenicka, Josef Nagl, Tobias Schopf, Heinrich Baumann, Axel Seikowsky
  • Publication number: 20120146625
    Abstract: The invention relates to a sensor arrangement for detecting at least one of the movement and the position of two components of an assembly, which are located close to each other or are disposed one inside the other and can be moved relative to each other, said sensor arrangement comprising at least one first sensor for detecting at least one of the movement and the position of the one component and a second sensor for detecting at least one of the movement and the position of the other component, the sensors functioning according to different measuring principles without affecting each other mutually.
    Type: Application
    Filed: October 5, 2010
    Publication date: June 14, 2012
    Applicant: MICRO-EPSILON MESSTECHNIK GMBH & CO.KG
    Inventors: Werner Grommer, Christian Pfaffinger, Axel Seikowsky
  • Patent number: 6318153
    Abstract: A sensor (1) is proposed for noncontacting thickness gauging on films (2), in particular blown films, with a sensor head (3) and a mount (4) for the sensor head (3), which provides reliable measuring results despite transportation-caused movements of the film (2), and which is particularly suitable for a continuous quality control during the production process. In accordance with the invention, the sensor head (3) comprises at least one noncontacting sensor element for gauging the thickness in accordance with the physical properties of the film (2). Furthermore, the position of the sensor head (3) is adjustable such that the sensor head (3) is held during the entire measuring process at a predeterminable, at least largely constant distance from the film (2).
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: November 20, 2001
    Assignee: Micro-Epsilon Messtechnik GmbH & Co. KG
    Inventors: Martin Dumberger, Axel Seikowsky, Martin Sellen, Karl Wisspeintner
  • Patent number: 5525903
    Abstract: A sensor arrangement and a method of acquiring properties of the surface layer (3) of a metallic target (2), which allow a nondestructive and substantially distance-independent measurement to be performed, with the requirements to be met by the sensor positioning being minimal. The sensor arrangement (1) comprises a combination of at least one eddy-current sensor (5) with at least one displacement measuring sensor (6), the depth of penetration of the eddy currents generated by the eddy-current sensor (5) corresponding to at least twice the thickness of the surface layer (3), and the displacement measuring sensor (6) serving to determine the distance of the sensor arrangement (1) from the target surface (4).
    Type: Grant
    Filed: August 18, 1994
    Date of Patent: June 11, 1996
    Assignee: Micro-Epsilon Messtechnik GmbH & Co. KG
    Inventors: Roland Mandl, Axel Seikowsky, Andreas Spang