Abstract: An arrangement for testing electric samples, such as, circuit components, circuit assemblies, and circuit cards having a plurality of probe contact points. An electromagnetic holding plate is provided on which several testing heads of the same and/or different probe contact point configuration are releasably mounted. The individual testing heads are arranged on the holding plate in accordance with the respective configuration of the sample. Each of the testing heads contains a number of testing tips which are adapted to the configuration of the probe contact points of their associated parts of the sample. The testing heads are connected to a suitable control unit which provides supply voltage and test pulses.